| Patent | Date |
|---|
Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assemblies
Grant 11,410,961 - Bayless , et al. August 9, 2 | 2022-08-09 |
Contaminant control in thermocompression bonding of semiconductors and associated systems and methods
Grant 11,410,964 - Wirz , et al. August 9, 2 | 2022-08-09 |
Methods and apparatus for protection of dielectric films during microelectronic component processing
Grant 11,289,360 - Bayless , et al. March 29, 2 | 2022-03-29 |
Apparatus And Methods For Enhanced Microelectronic Device Handling
App 20220016768 - Tseng; Kuan Wei ; et al. | 2022-01-20 |
Method For Semiconductor Die Edge Protection And Semiconductor Die Separation
App 20220013401 - Wirz; Brandon P. ; et al. | 2022-01-13 |
Methods And Apparatus For Temperature Modification And Reduction Of Contamination In Bonding Stacked Microelectronic Devices
App 20210384042 - Qu; Xiaopeng ; et al. | 2021-12-09 |
Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devices
Grant 11,189,609 - Wirz , et al. November 30, 2 | 2021-11-30 |
Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assemblies
Grant 11,189,590 - Bayless , et al. November 30, 2 | 2021-11-30 |
Methods For Reducing Heat Transfer In Semiconductor Assemblies, And Associated Systems And Devices
App 20210343692 - Wirz; Brandon P. ; et al. | 2021-11-04 |
Methods And Apparatus For Temperature Modification In Bonding Stacked Microelectronic Components And Related Substrates And Assemblies
App 20210296192 - Bayless; Andrew M. ; et al. | 2021-09-23 |
Disposing Protective Cover Film And Underfill Layer Over Singulated Integrated Circuit Dice For Protection During Integrated Circuit Processing
App 20210272846 - Bayless; Andrew M. ; et al. | 2021-09-02 |
Thermocompression Bond Tips And Related Apparatus And Methods
App 20210233887 - McClain; Benjamin L. ; et al. | 2021-07-29 |
Semiconductor Device Assembly With Surface-mount Die Support Structures
App 20210193606 - Wirz; Brandon P. ; et al. | 2021-06-24 |
Thin Die Release For Semiconductor Device Assembly
App 20210183702 - Bayless; Andrew M. ; et al. | 2021-06-17 |
Processes For Adjusting Dimensions Of Dielectric Bond Line Materials And Related Films, Articles And Assemblies
App 20210183806 - Bayless; Andrew M. ; et al. | 2021-06-17 |
Methods And Apparatus For Protection Of Dielectric Films During Microelectronic Component Processing
App 20210183682 - Bayless; Andrew M. ; et al. | 2021-06-17 |
Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects
App 20210183802 - WIRZ; BRANDON P. ; et al. | 2021-06-17 |
Semiconductor Device Assembly With Die Support Structures
App 20210167030 - Wirz; Brandon P. ; et al. | 2021-06-03 |
Thermocompression bond tips and related apparatus and methods
Grant 11,024,595 - McClain , et al. June 1, 2 | 2021-06-01 |
Contaminant Control In Thermocompression Bonding Of Semiconductors And Associated Systems And Methods
App 20210159206 - Wirz; Brandon P. ; et al. | 2021-05-27 |
Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices
Grant 11,004,828 - Wirz , et al. May 11, 2 | 2021-05-11 |
Method for Substrate Moisture NCF Voiding Elimination
App 20210111132 - WIRZ; BRANDON P. ; et al. | 2021-04-15 |
Semiconductor device assembly with surface-mount die support structures
Grant 10,950,568 - Wirz , et al. March 16, 2 | 2021-03-16 |
Methods And Apparatus For Integrated Gang Bonding And Encapsulation Of Stacked Microelectronic Devices
App 20210066246 - Wirz; Brandon P. ; et al. | 2021-03-04 |
Semiconductor device assembly with die support structures
Grant 10,923,447 - Wirz , et al. February 16, 2 | 2021-02-16 |
Method for substrate moisture NCF voiding elimination
Grant 10,879,195 - Wirz , et al. December 29, 2 | 2020-12-29 |
Electronic devices having tapered edge walls
Grant 10,825,761 - Wirz , et al. November 3, 2 | 2020-11-03 |
Methods of processing semiconductor devices
Grant 10,825,762 - Wirz , et al. November 3, 2 | 2020-11-03 |
Method for Substrate Moisture NCF Voiding Elimination
App 20190252330 - WIRZ; BRANDON P. ; et al. | 2019-08-15 |
Method for 3D Ink Jet TCB Interconnect Control
App 20190131272 - Wirz; Brandon P. ; et al. | 2019-05-02 |
Method for 3D ink jet TCB interconnect control
Grant 10,276,539 - Wirz , et al. | 2019-04-30 |
Methods of processing semiconductor devices
Grant 10,276,479 - Wirz , et al. | 2019-04-30 |
Methods Of Processing Semiconductor Devices
App 20190109081 - Wirz; Brandon P. ; et al. | 2019-04-11 |
Electronic Devices Having Tapered Edge Walls
App 20190109080 - Wirz; Brandon P. ; et al. | 2019-04-11 |
Methods Of Processing Semiconductor Devices
App 20190109079 - Wirz; Brandon P. ; et al. | 2019-04-11 |
Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects
App 20190067232 - WIRZ; BRANDON P. ; et al. | 2019-02-28 |
Thermocompression Bond Tips And Related Apparatus And Methods
App 20180366434 - McClain; Benjamin L. ; et al. | 2018-12-20 |
Semiconductor Device Assembly With Die Support Structures
App 20180342475 - Wirz; Brandon P. ; et al. | 2018-11-29 |
Semiconductor Device Assembly With Surface-mount Die Support Structures
App 20180342476 - Wirz; Brandon P. ; et al. | 2018-11-29 |
Method for mount tape die release system for thin die ejection
Grant 10,043,688 - Minnich , et al. August 7, 2 | 2018-08-07 |
Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
Grant 9,966,347 - Wirz , et al. May 8, 2 | 2018-05-08 |
Under-bump Metal Structures For Interconnecting Semiconductor Dies Or Packages And Associated Systems And Methods
App 20170287857 - Wirz; Brandon P. ; et al. | 2017-10-05 |
Semiconductor devices and methods for backside photo alignment
Grant 9,741,612 - Wirz , et al. August 22, 2 | 2017-08-22 |
Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
Grant 9,704,781 - Wirz , et al. July 11, 2 | 2017-07-11 |
Semiconductor Devices And Methods For Backside Photo Alignment
App 20160172242 - Wirz; Brandon P. ; et al. | 2016-06-16 |
Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages
Grant 9,362,143 - Sun , et al. June 7, 2 | 2016-06-07 |
Semiconductor devices and methods for backside photo alignment
Grant 9,299,663 - Wirz , et al. March 29, 2 | 2016-03-29 |
Semiconductor Devices And Methods For Backside Photo Alignment
App 20150333014 - Wirz; Brandon P. ; et al. | 2015-11-19 |
Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias
Grant 9,123,700 - Gandhi , et al. September 1, 2 | 2015-09-01 |
Under-bump Metal Structures For Interconnecting Semiconductor Dies Or Packages And Associated Systems And Methods
App 20150137353 - Wirz; Brandon P. ; et al. | 2015-05-21 |
Methods For Forming Semiconductor Device Packages With Photoimageable Dielectric Adhesive Material, And Related Semiconductor Device Packages
App 20130299986 - Sun; Yangyang ; et al. | 2013-11-14 |
Integrated Circuit Constructions Having Through Substrate Vias And Methods Of Forming Integrated Circuit Constructions Having Through Substrate Vias
App 20130175698 - Gandhi; Jaspreet S. ; et al. | 2013-07-11 |
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