loadpatents
Patent applications and USPTO patent grants for Wing; Kenneth E..The latest application filed is for "selective encapsulation of electronic components".
Patent | Date |
---|---|
Low pressure molding encapsulation of high voltage circuitry Grant 8,627,563 - Wing , et al. January 14, 2 | 2014-01-14 |
Regulated output current and slope control Grant 8,564,986 - Wing , et al. October 22, 2 | 2013-10-22 |
Selective encapsulation of electronic components App 20120017436 - Wing; Kenneth E. ;   et al. | 2012-01-26 |
Regulated Output Current And Slope Control App 20100321967 - Wing; Kenneth E. ;   et al. | 2010-12-23 |
Low Pressure Molding Encapsulation Of High Voltage Circuitry App 20100314792 - Wing; Kenneth E. ;   et al. | 2010-12-16 |
High Voltage Recessed Connector Contact App 20100302746 - Wing; Kenneth E. ;   et al. | 2010-12-02 |
Bipolar power supply system Grant 7,710,745 - Weinstein , et al. May 4, 2 | 2010-05-04 |
Self Tuning High Voltage Power Supply App 20080303505 - Wing; Kenneth E. ;   et al. | 2008-12-11 |
High Voltage Electrical Connectors App 20080248669 - Wing; Kenneth E. ;   et al. | 2008-10-09 |
Bipolar Power Supply System App 20080074904 - Weinstein; Eliahu ;   et al. | 2008-03-27 |
Selective Encapsulation of Electronic Components App 20070289129 - Wing; Kenneth E. ;   et al. | 2007-12-20 |
Cooperative energy farms and virtual net metering App 20070219932 - Carroll; Scott T. ;   et al. | 2007-09-20 |
Printed circuit board daughter board support Grant D495,586 - Carroll , et al. September 7, 2 | 2004-09-07 |
Printed circuit board daughter board support Grant D492,575 - Carroll , et al. July 6, 2 | 2004-07-06 |
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