Winderl; Johann

Patent Applications and Registrations

Patent applications and USPTO patent grants for Winderl; Johann.The latest application filed is for "method for applying a semiconductor chip to a carrier element".

Company Profile

0.9.7

Winderl; Johann - Wackersdorf DE
Winderl; Johann - Neunburg v.W. DE
Winderl; Johann - Neunburg DE
Winderl, Johann - Wackersdort DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for connecting at least one chip to an external wiring configuration Grant 7,036,216 - Hauser , et al. May 2, 2	2006-05-02
Method for applying a semiconductor chip to a carrier element Grant 7,008,493 - Winderl , et al. March 7, 2	2006-03-07
Electronic component with stacked semiconductor chips Grant 6,894,378 - Winderl May 17, 2	2005-05-17
Electronic component with a semiconductor chip and method of producing an electronic component Grant 6,891,252 - Winderl , et al. May 10, 2	2005-05-10
Method for applying a semiconductor chip to a carrier element App 20040074585 - Winderl, Johann ; et al.	2004-04-22
Apparatus for applying a semiconductor chip to a carrier element with a compensating layer Grant 6,664,648 - Winderl , et al. December 16, 2	2003-12-16
Lead frame for the installation of an integrated circuit in an injection-molded package Grant 6,614,100 - Hauser , et al. September 2, 2	2003-09-02
Method and apparatus for connecting at least one chip to an external wiring configuration App 20030066188 - Hauser, Christian ; et al.	2003-04-10
Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method Grant 6,534,345 - Muff , et al. March 18, 2	2003-03-18
Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them Grant 6,525,416 - Hauser , et al. February 25, 2	2003-02-25
Electronic component with stacked semiconductor chips App 20020121687 - Winderl, Johann	2002-09-05
Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them App 20020041017 - Hauser, Christian ; et al.	2002-04-11
Method for singling semiconductor components and semiconductor component singling device Grant 6,364,751 - Pohl , et al. April 2, 2	2002-04-02
Device for packaging electronic components App 20010045641 - Hauser, Christian ; et al.	2001-11-29
Semiconductor component and method for manufacturing it App 20010036720 - Hauser, Christian ; et al.	2001-11-01
Method and apparatus for applying a semiconductor chip to a carrier element App 20010031512 - Winderl, Johann ; et al.	2001-10-18

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