Windeln; Johannes

Patent Applications and Registrations

Patent applications and USPTO patent grants for Windeln; Johannes.The latest application filed is for "solar cell with reduced absorber thickness and reduced back surface recombination".

Company Profile

0.12.15

Windeln; Johannes - Bodenheim DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solar cell with reduced absorber thickness and reduced back surface recombination Grant 10,283,653 - Eickelmann , et al.	2019-05-07
Solar cell with reduced absorber thickness and reduced back surface recombination Grant 9,825,192 - Eickelmann , et al. November 21, 2	2017-11-21
Solar cell with reduced absorber thickness and reduced back surface recombination Grant 9,773,927 - Eickelmann , et al. September 26, 2	2017-09-26
Solar Cell With Reduced Absorber Thickness and Reduced Back Surface Recombination App 20170179313 - Eickelmann; Hans-Juergen ; et al.	2017-06-22
Solar Cell With Reduced Absorber Thickness and Reduced Back Surface Recombination App 20160240702 - Eickelmann; Hans-Juergen ; et al.	2016-08-18
Solar cell with reduced absorber thickness and reduced back surface recombination Grant 9,368,666 - Eickelmann , et al. June 14, 2	2016-06-14
Solar cell with reduced absorber thickness and reduced back surface recombination Grant 9,246,039 - Eickelmann , et al. January 26, 2	2016-01-26
Solar Cell With Reduced Absorber Thickness And Reduced Back Surface Recombination App 20150380587 - Eickelmann; Hans-Juergen ; et al.	2015-12-31
Solar Cell With Reduced Absorber Thickness And Reduced Back Surface Recombination App 20150179859 - Eickelmann; Hans-Juergen ; et al.	2015-06-25
Method for high density data storage and imaging Grant 8,792,318 - Duerig , et al. July 29, 2	2014-07-29
Solar Cell With Reduced Absorber Thickness And Reduced Back Surface Recombination App 20140102509 - Eickelmann; Hans-Juergen ; et al.	2014-04-17
Process For Treating Woven Glass Cloth App 20130061401 - Boday; Dylan J. ; et al.	2013-03-14
Packaging a semiconductor wafer Grant 8,368,519 - Kuehl , et al. February 5, 2	2013-02-05
Method for high density data storage and imaging Grant 8,289,833 - Duerig , et al. October 16, 2	2012-10-16
Method For High Density Data Storage And Imaging App 20120155242 - Duerig; Urs T. ; et al.	2012-06-21
Method for high density data storage and imaging Grant 8,129,496 - Duerig , et al. March 6, 2	2012-03-06
Method For High Density Data Storage And Imaging App 20120033539 - Duerig; Urs T. ; et al.	2012-02-09
Method For High Density Data Storage And Imaging App 20120034383 - Duerig; Urs T. ; et al.	2012-02-09
Method for forming deformed regions in a resin layer Grant 8,102,753 - Duerig , et al. January 24, 2	2012-01-24
Packaging A Semiconductor Wafer App 20090096589 - Kuehl; Hartmut ; et al.	2009-04-16
Method For High Density Data Storage And Imaging App 20080219135 - Duerig; Urs T. ; et al.	2008-09-11
Method for high density data storage and imaging App 20070196645 - Duerig; Urs T. ; et al.	2007-08-23
Method For High Density Data Storage And Imaging App 20070195682 - Duerig; Urs T. ; et al.	2007-08-23
Method for recycling a disk having a layered structure on a glass substrate App 20020084247 - Hammel, Dirk ; et al.	2002-07-04

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