Winbond Electronic Corp.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Winbond Electronic Corp..The latest application filed is for "baffle device".
- Winbond Electronic Corp. - Taichung TW
- Winbond Electronic Corp. - Hsinchu TW
- Winbond Electronic Corporation - Hsin-Chu TW
| Patent | Date |
|---|---|
| DRAM semiconductor device having reduced parasitic capacitance between capacitor contacts and bit line structures and method for manufacturing the same Grant 10,797,057 - Chang , et al. October 6, 2 | 2020-10-06 |
| Baffle device App 20030217810 - Chen, Fu-sheng ; et al. | 2003-11-27 |
| Intercommunicating toy App 20030003839 - Lin, Chun-Ping | 2003-01-02 |
| Method for data transmission App 20020184417 - Lin, Chun-Ping ; et al. | 2002-12-05 |
| Column redundancy circuitry with reduced time delay Grant 6,205,515 - Huang March 20, 2 | 2001-03-20 |
| Telephone dialing device and the operating method thereof Grant 5,363,437 - Shen , et al. November 8, 1 | 1994-11-08 |
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