Trademark applications and grants for Wilson William E. Wilson William E has 2 trademark applications. The latest application filed is for "URBAN NAIL"
Patent Application | Date |
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THERMAL SUBSTRATE 20130025839 - 13/189980 Egitto; Frank ;   et al. | 2013-01-31 |
LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATION 20120243147 - 12/904305 Marconi; Francesco F. ;   et al. | 2012-09-27 |
CORELESS LAYER BUILDUP STRUCTURE 20120160547 - 12/764993 Antesberger; Timothy ;   et al. | 2012-06-28 |
CORELESS LAYER BUILDUP STRUCTURE WITH LGA 20120160544 - 12/764994 Antesberger; Timothy ;   et al. | 2012-06-28 |
CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER 20120031649 - 12/764997 Antesberger; Timothy ;   et al. | 2012-02-09 |
Electronic package including high density interposer and circuitized substrate assembly utilizing same 8,405,229 - 12/592,682 Antesberger , et al. March 26, 2 | 2013-03-26 |
Electronic package including high density interposer and circuitized substrate assembly utilizing same 8,405,229 - 12/592,682 Antesberger , et al. March 26, 2 | 2013-03-26 |
Method of making high density interposer and electronic package utilizing same 8,245,392 - 12/592,734 Antesberger , et al. August 21, 2 | 2012-08-21 |
Method of joining a semiconductor device/chip to a printed wiring board 8,240,031 - 12/837,640 Markovich , et al. August 14, 2 | 2012-08-14 |
Method of making circuitized substrate 7,381,587 - 11/324,432 Japp , et al. June 3, 2 | 2008-06-03 |
Mark Image Registration | Serial | Trademark Application Date |
---|---|
![]() "URBAN NAIL" 5366667 77022481 |
URBAN NAIL 2006-10-17 |
![]() "QUINTESS" 76131441 |
QUINTESS 2000-09-20 |
NCAGE Code | 864B1 | WILSON, WILLIAM E!DBA WILSON GROUP SERVICES |
CAGE Code | 864B1 | WILSON, WILLIAM E WILSON GROUP SERVICES |
S.A.M. Registration | 864B1 [81365380] | WILSON, WILLIAM E WILSON GROUP SERVICES |
DUNS | 081365380 | Wilson, WIlliam E |
SEC | 0001194787 | WILSON WILLIAM E |
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