Wilson; Charles H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wilson; Charles H..The latest application filed is for "chip-on-chip structure and methods of manufacture".

Company Profile

2.12.12

Wilson; Charles H. - Essex Junction VT
Wilson; Charles H. - Etowah TN
Wilson; Charles H. - Beckley WV
Wilson; Charles H. - Minneapolis MN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing chip-on-chip structure comprising sinterted pillars Grant 10,734,346 - Graf , et al.	2020-08-04
Chip-on-chip Structure And Methods Of Manufacture App 20190244926 - Graf; Richard S. ; et al.	2019-08-08
Chip-on-chip structure and methods of manufacture Grant 10,340,241 - Graf , et al.	2019-07-02
Chip-on-chip Structure And Methods Of Manufacture App 20190148328 - GRAF; Richard S. ; et al.	2019-05-16
IC structure with angled interconnect elements Grant 9,754,911 - West , et al. September 5, 2	2017-09-05
Ic Structure With Angled Interconnect Elements App 20170098623 - West; David J. ; et al.	2017-04-06
Chip-on-chip Structure And Methods Of Manufacture App 20160365328 - GRAF; Richard S. ; et al.	2016-12-15
Chip-on-chip Structure And Methods Of Manufacture App 20160365329 - GRAF; Richard S. ; et al.	2016-12-15
Embedded heat spreader with electrical properties Grant 9,368,425 - Graf , et al. June 14, 2	2016-06-14
Embedded Heat Spreader With Electrical Properties App 20150179542 - Graf; Richard S. ; et al.	2015-06-25
Quad flat no-lead chip carrier with standoff Grant 8,134,225 - Maloney , et al. March 13, 2	2012-03-13
Pressurized Oxygen For Evaluation Of Molding Compound Stability In Semiconductor Packaging App 20090064763 - Comeau; Joseph K. V. ; et al.	2009-03-12
Quad Flat No-lead Chip Carrier With Standoff App 20080265396 - Maloney; John J. ; et al.	2008-10-30
Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging Grant 7,442,552 - Comeau , et al. October 28, 2	2008-10-28
Quad Flat No-lead Chip Carrier With Stand-off App 20080203546 - Maloney; John J. ; et al.	2008-08-28
Quad flat no-lead chip carrier with stand-off Grant 7,405,106 - Maloney , et al. July 29, 2	2008-07-29
Pressurized Oxygen For Evaluation Of Molding Compound Stability In Semiconductor Packaging App 20080006079 - Comeau; Joseph K. V. ; et al.	2008-01-10
Quad flat no-lead chip carrier with stand-off App 20070273017 - Maloney; John J. ; et al.	2007-11-29
Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging Grant 7,300,796 - Comeau , et al. November 27, 2	2007-11-27
Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging App 20050054109 - Comeau, Joseph K.V. ; et al.	2005-03-10
Method and system for analyzing and classifying electronic information Grant 6,556,982 - McGaffey , et al. April 29, 2	2003-04-29
Method of applying flex tape protective coating onto a flex product Grant 5,546,655 - Feger , et al. August 20, 1	1996-08-20
Flex tape protective coating Grant 5,360,946 - Feger , et al. November 1, 1	1994-11-01
Telephone calculator Grant 3,995,123 - Wilson November 30, 1	1976-11-30

Company Registrations

SEC

0001494404

WILSON CHARLES H.

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