Williamson; Jaimal Mallory

Patent Applications and Registrations

Patent applications and USPTO patent grants for Williamson; Jaimal Mallory.The latest application filed is for "package substrate with cte matching barrier ring around microvias".

Company Profile

7.9.14

Williamson; Jaimal Mallory - McKinney TX
Williamson; Jaimal Mallory - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package Substrate With Cte Matching Barrier Ring Around Microvias App 20220254735 - Williamson; Jaimal Mallory ; et al.	2022-08-11
Package Substrate With Partially Recessed Capacitor App 20220223509 - Williamson; Jaimal Mallory ; et al.	2022-07-14
Enhanced Mold Compound Thermal Conductivity App 20220122936 - WILLIAMSON; Jaimal Mallory ; et al.	2022-04-21
Package substrate with partially recessed capacitor Grant 11,289,412 - Williamson , et al. March 29, 2	2022-03-29
Package substrate with CTE matching barrier ring around microvias Grant 11,270,955 - Williamson , et al. March 8, 2	2022-03-08
Via integrity and board level reliability testing Grant 11,081,406 - Williamson , et al. August 3, 2	2021-08-03
Package Substrate With Partially Recessed Capacitor App 20200294899 - Williamson; Jaimal Mallory ; et al.	2020-09-17
Semiconductor devices having metal posts for stress relief at flatness discontinuities Grant 10,748,863 - Williamson , et al. A	2020-08-18
Semiconductor Device Package With Improved Die Pad And Solder Mask Design App 20200251436 - Kind Code	2020-08-06
Package Substrate With Cte Matching Barrier Ring Around Microvias App 20200176396 - WILLIAMSON; JAIMAL MALLORY ; et al.	2020-06-04
Leadframe having organic, polymerizable photo-imageable adhesion layer Grant 10,672,692 - Williamson , et al.	2020-06-02
Via Integrity And Board Level Reliability Testing App 20190393106 - Williamson; Jaimal Mallory ; et al.	2019-12-26
Semiconductor Devices Having Metal Posts For Stress Relief At Flatness Discontinuities App 20180190606 - Williamson; Jaimal Mallory ; et al.	2018-07-05
Process For Forming Leadframe Having Organic, Polymerizable Photo-imageable Adhesion Layer App 20180096859 - Williamson; Jaimal Mallory ; et al.	2018-04-05
Leadframe Having Organic, Polymerizable Photo-Imageable Adhesion Layer App 20180096860 - Williamson; Jaimal Mallory ; et al.	2018-04-05
Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer Grant 9,934,989 - Williamson , et al. April 3, 2	2018-04-03
Integrated circuit package and method of manufacture Grant 9,281,269 - Williamson , et al. March 8, 2	2016-03-08
Integrated Circuit Package And Method Of Manufacture App 20140138822 - Williamson; Jaimal Mallory ; et al.	2014-05-22
Wire-based methodology of widening the pitch of semiconductor chip terminals Grant 8,674,504 - Odegard , et al. March 18, 2	2014-03-18
Wire-Based Methodology of Widening the Pitch of Semiconductor Chip Terminals App 20130307141 - Odegard; Charles Anthony ; et al.	2013-11-21
Fluidic Cooling Systems And Methods For Electronic Components App 20060104031 - Colgan; Evan George ; et al.	2006-05-18

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