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Patent applications and USPTO patent grants for Williamson; Jaimal M..The latest application filed is for "semiconductor substrate having stress-absorbing surface layer".
Patent | Date |
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Semiconductor substrate having stress-absorbing surface layer Grant 10,490,515 - Williamson , et al. Nov | 2019-11-26 |
Semiconductor Substrate Having Stress-Absorbing Surface Layer App 20190279944 - Williamson; Jaimal M. ;   et al. | 2019-09-12 |
Semiconductor substrate having stress-absorbing surface layer Grant 10,347,589 - Williamson , et al. July 9, 2 | 2019-07-09 |
Semiconductor Substrate Having Stress-Absorbing Surface Layer App 20170229405 - Williamson; Jaimal M. ;   et al. | 2017-08-10 |
Semiconductor substrate having stress-absorbing surface layer Grant 9,673,065 - Williamson , et al. June 6, 2 | 2017-06-06 |
Semiconductor Substrate Having Stress-absorbing Surface Layer App 20150021762 - Williamson; Jaimal M. ;   et al. | 2015-01-22 |
Non-hermetic Encapsulant Removal For Module Rework App 20080076690 - Coico; Patrick A. ;   et al. | 2008-03-27 |
Fluidic cooling systems and methods for electronic components Grant 7,079,393 - Colgan , et al. July 18, 2 | 2006-07-18 |
Non-hermetic Encapsulant Removal For Module Rework App 20050066995 - Coico, Patrick A. ;   et al. | 2005-03-31 |
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