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name:-0.0063199996948242
name:-0.0054981708526611
name:-0.0040819644927979
Williamson; Jaimal M. Patent Filings

Williamson; Jaimal M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Williamson; Jaimal M..The latest application filed is for "semiconductor substrate having stress-absorbing surface layer".

Company Profile
3.4.5
  • Williamson; Jaimal M. - McKinney TX
  • Williamson; Jaimal M. - Wappingers Falls NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor substrate having stress-absorbing surface layer
Grant 10,490,515 - Williamson , et al. Nov
2019-11-26
Semiconductor Substrate Having Stress-Absorbing Surface Layer
App 20190279944 - Williamson; Jaimal M. ;   et al.
2019-09-12
Semiconductor substrate having stress-absorbing surface layer
Grant 10,347,589 - Williamson , et al. July 9, 2
2019-07-09
Semiconductor Substrate Having Stress-Absorbing Surface Layer
App 20170229405 - Williamson; Jaimal M. ;   et al.
2017-08-10
Semiconductor substrate having stress-absorbing surface layer
Grant 9,673,065 - Williamson , et al. June 6, 2
2017-06-06
Semiconductor Substrate Having Stress-absorbing Surface Layer
App 20150021762 - Williamson; Jaimal M. ;   et al.
2015-01-22
Non-hermetic Encapsulant Removal For Module Rework
App 20080076690 - Coico; Patrick A. ;   et al.
2008-03-27
Fluidic cooling systems and methods for electronic components
Grant 7,079,393 - Colgan , et al. July 18, 2
2006-07-18
Non-hermetic Encapsulant Removal For Module Rework
App 20050066995 - Coico, Patrick A. ;   et al.
2005-03-31

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