Susan Williams

USPTO Trademark & Patent Filings

Williams Susan

Trademark applications and grants for Susan Williams. Susan Williams has 14 trademark applications. The latest application filed is for "CLEAN ROD SYSTEM"

Company Profile
    Company Aliases
  • Susan Williams
  • WILLIAMS, SUSAN
  • susan williams
  • Williams; Susan - Bellevue WA
  • WILLIAMS; Susan - New Berlin WI
  • Williams; Susan - Balmain AU
Entity Type INDIVIDUAL
Address #20 Varennes Ct Little Rock, ARKANSAS UNITED STATES 72223

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks Patents
Patent Applications
Patent ApplicationDate
SOFTWARE PRODUCT USING GAMING PROTOCOLS AND TECHNOLOGY TO HELP PEOPLE DEAL WITH CHRONIC CONDITIONS
20150093733 - 14/504177 Surve; Swatee ;   et al.
2015-04-02
QUALITY LEVEL VALUATION SYSTEM AND METHOD
20130097201 - 13/651082 Brydon; Norrine ;   et al.
2013-04-18
APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS
20120048185 - 13/290114 Williams; Susan ;   et al.
2012-03-01
PRINTHEAD ASSEMBLY WITH MOLDED INK MANIFOLD HAVING POLYMER COATING
20110304672 - 13/214219 Lee; Seung Jin ;   et al.
2011-12-15
PRINTHEAD ASSEMBLY WITH MINIMAL LEAKAGE
20110085010 - 12/973307 Keshishian; Sarkis Minas ;   et al.
2011-04-14
Printhead assembly with minimal leakage
8,444,252 - 12/973,307 Keshishian , et al. May 21, 2
2013-05-21
Printhead assembly with minimal leakage
8,444,252 - 12/973,307 Keshishian , et al. May 21, 2
2013-05-21
Double laser drilling of a printhead integrated circuit attachment film
8,293,057 - 12/049,371 Ramachandra , et al. October 23, 2
2012-10-23
Printhead assembly with molded ink manifold having polymer coating
8,132,893 - 13/214,219 Lee , et al. March 13, 2
2012-03-13
Electronic component with wire bonds in low modulus fill encapsulant
8,063,318 - 12/364,514 Williams , et al. November 22, 2
2011-11-22
Patent Grants & Applications

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