Williams; Damon Vincent

Patent Applications and Registrations

Patent applications and USPTO patent grants for Williams; Damon Vincent.The latest application filed is for "methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing".

Company Profile

0.9.5

Williams; Damon Vincent - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head Grant 7,481,695 - Saldana , et al. January 27, 2	2009-01-27
Apparatus for controlling retaining ring and wafer head tilt for chemical mechanical polishing Grant 6,976,903 - Williams December 20, 2	2005-12-20
Methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing Grant 6,843,707 - Saldana , et al. January 18, 2	2005-01-18
Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film Grant 6,752,703 - Boyd , et al. June 22, 2	2004-06-22
Methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing App 20040102138 - Saldana, Miguel Angel ; et al.	2004-05-27
Active retaining ring support Grant 6,719,874 - Gotkis , et al. April 13, 2	2004-04-13
Apparatus for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing Grant 6,709,322 - Saldana , et al. March 23, 2	2004-03-23
System for wafer carrier in-process clean and rinse Grant 6,659,116 - Williams , et al. December 9, 2	2003-12-09
Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing Grant 6,652,357 - Williams November 25, 2	2003-11-25
Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head Grant 6,640,155 - Saldana , et al. October 28, 2	2003-10-28
Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film App 20030119431 - Boyd, John M. ; et al.	2003-06-26
Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head App 20020188370 - Saldana, Miguel A. ; et al.	2002-12-12
Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing App 20020151254 - Saldana, Miguel Angel ; et al.	2002-10-17
Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head App 20020146970 - Saldana, Miguel A. ; et al.	2002-10-10

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