WILLIAMS; Carl D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for WILLIAMS; Carl D..The latest application filed is for "liquid cooled cold plate for multiple semiconductor chip packages".

Company Profile

0.6.9

WILLIAMS; Carl D. - Manitou Springs CO
Williams; Carl D. - Hillsboro OR
WILLIAMS; Carl D. - Akron OH
Williams; Carl D. - Colorado Springs CO US
Williams; Carl D. - Waterdown CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid Cooled Cold Plate For Multiple Semiconductor Chip Packages App 20220173015 - SUBRAHMANYAM; Prabhakar ; et al.	2022-06-02
Cold Plate System Interface For Liquid Cooled Devices App 20210127529 - Hanna; Timothy Glen ; et al.	2021-04-29
Electronic module with removable fan assembly Grant 9,723,748 - Williams August 1, 2	2017-08-01
Electronic Module With Removable Fan Assembly App 20160053776 - Williams; Carl D.	2016-02-25
Utility Pedestal Cover Or Planter App 20130133796 - WILLIAMS; Carl D.	2013-05-30
Electronic connectors and form factor adapters for electronic components Grant 8,441,786 - Williams May 14, 2	2013-05-14
Drop-in Mounting Structure For Computing Components Utilizing Contact Connectors App 20120170214 - WILLIAMS; CARL D.	2012-07-05
Electronic Connectors And Form Factor Adapters For Electronic Components App 20110069443 - Williams; Carl D.	2011-03-24
Utility Pedestal Cover Or Planter App 20100058660 - WILLIAMS; Carl D.	2010-03-11
Electronic module latching mechanism App 20060134953 - Williams; Carl D. ; et al.	2006-06-22
Sealable housing for electrical components Grant 5,798,910 - Holbeche , et al. August 25, 1	1998-08-25
Hydrodynamic bearing having inverted surface tension seals Grant 5,533,811 - Polch , et al. July 9, 1	1996-07-09
Method and apparatus for applying lubricant to a hydrodynamic bearing Grant 5,524,728 - Williams , et al. June 11, 1	1996-06-11

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