Willey; Mark J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Willey; Mark J..The latest application filed is for "wetting pretreatment for enhanced damascene metal filling".

Company Profile

0.16.14

Willey; Mark J. - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wetting pretreatment for enhanced damascene metal filling Grant 10,840,101 - Mayer , et al. November 17, 2	2020-11-17
Wetting Pretreatment For Enhanced Damascene Metal Filling App 20180138044 - Mayer; Steven T. ; et al.	2018-05-17
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte App 20180030611 - Spurlin; Tighe A. ; et al.	2018-02-01
Wetting pretreatment for enhanced damascene metal filling Grant 9,852,913 - Mayer , et al. December 26, 2	2017-12-26
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte Grant 9,816,196 - Spurlin , et al. November 14, 2	2017-11-14
Apparatus for wetting pretreatment for enhanced damascene metal filling Grant 9,721,800 - Mayer , et al. August 1, 2	2017-08-01
Through silicon via filling using an electrolyte with a dual state inhibitor Grant 9,593,426 - Willey , et al. March 14, 2	2017-03-14
Wetting Pretreatment For Enhanced Damascene Metal Filling App 20150179458 - Mayer; Steven T. ; et al.	2015-06-25
Through Silicon Via Filling Using An Electrolyte With A Dual State Inhibitor App 20150159289 - Willey; Mark J. ; et al.	2015-06-11
Apparatus For Wetting Pretreatment For Enhanced Damascene Metal Filling App 20150096883 - Mayer; Steven T. ; et al.	2015-04-09
Through silicon via filling using an electrolyte with a dual state inhibitor Grant 8,992,757 - Willey , et al. March 31, 2	2015-03-31
Wetting pretreatment for enhanced damascene metal filling Grant 8,962,085 - Mayer , et al. February 24, 2	2015-02-24
Process for through silicon via filling Grant 8,722,539 - Reid , et al. May 13, 2	2014-05-13
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte App 20130284604 - Spurlin; Tighe A. ; et al.	2013-10-31
Systems and methods for monitoring plating and etching baths Grant 8,475,642 - West , et al. July 2, 2	2013-07-02
Monitoring of electroplating additives Grant 8,372,258 - Willey , et al. February 12, 2	2013-02-12
By-product Mitigation In Through-silicon-via Plating App 20120064462 - WILLEY; Mark J. ; et al.	2012-03-15
Through Silicon Via Filling Using An Electrolyte With A Dual State Inhibitor App 20110284386 - Willey; Mark J. ; et al.	2011-11-24
Monitoring of electroplating additives App 20110025338 - Willey; Mark J. ; et al.	2011-02-03
Wetting Pretreatment For Enhanced Damascene Metal Filling App 20100320609 - Mayer; Steven T. ; et al.	2010-12-23
Apparatus For Wetting Pretreatment For Enhanced Damascene Metal Filling App 20100320081 - Mayer; Steven T. ; et al.	2010-12-23
Process for through silicon via filing Grant 7,776,741 - Reid , et al. August 17, 2	2010-08-17
Process For Through Silicon Via Filing App 20100041226 - Reid; Jonathan D. ; et al.	2010-02-18
Systems And Methods For Monitoring Plating And Etching Baths App 20080264801 - West; Alan C. ; et al.	2008-10-30

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