Willett; William B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Willett; William B..The latest application filed is for "copper sputtering targets and methods of forming copper sputtering targets".

Company Profile

0.5.8

Willett; William B. - Spokane WA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper sputtering targets and methods of forming copper sputtering targets Grant 7,767,043 - Segal , et al. August 3, 2	2010-08-03
Copper Sputtering Targets and Methods of Forming Copper Sputtering Targets App 20100059147 - Segal; Vladimir M. ; et al.	2010-03-11
Modified Sputtering Target And Deposition Components, Methods Of Production And Uses Thereof App 20090194414 - Nolander; Ira G. ; et al.	2009-08-06
Copper Sputtering Targets and Methods of Forming Copper Sputtering Targets App 20090020192 - Segal; Vladimir M. ; et al.	2009-01-22
Sputtering targets formed from cast materials Grant 6,878,250 - Segal , et al. April 12, 2	2005-04-12
Methods of fabricating articles and sputtering targets Grant 6,723,187 - Segal , et al. April 20, 2	2004-04-20
Copper sputtering targets and methods of forming copper sputtering targets App 20040072009 - Segal, Vladimir M. ; et al.	2004-04-15
Transferrable compliant fibrous thermal interface Grant 6,676,796 - Pinter , et al. January 13, 2	2004-01-13
Transferrable compliant fibrous thermal interface Grant 6,436,506 - Pinter , et al. August 20, 2	2002-08-20
Methods for controlling the texture of alloys utilizing equal channel angular extrusion App 20020007880 - Segal, Vladimir ; et al.	2002-01-24
Alloys formed from cast materials utilizing equal channel angular extrusion App 20020000272 - Segal, Vladimir ; et al.	2002-01-03
Methods of fabricating articles and sputtering targets App 20010054457 - Segal, Vladimir ; et al.	2001-12-27
Transferrable compliant fibrous thermal interface App 20010006715 - Pinter, Michael R. ; et al.	2001-07-05

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