Will; Barbara

Patent Applications and Registrations

Patent applications and USPTO patent grants for Will; Barbara.The latest application filed is for "method and device for locally removing and/or modifying a polymer material on a surface".

Company Profile

0.5.5

Will; Barbara - Herrenberg DE
Will; Barbara - Harrenberg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method And Device For Locally Removing And/or Modifying A Polymer Material On A Surface App 20220306461 - Will; Barbara ; et al.	2022-09-29
Method for forming trenches in a semiconductor component Grant 8,679,975 - Reinmuth , et al. March 25, 2	2014-03-25
Method For Forming Trenches In A Semiconductor Component App 20110169125 - REINMUTH; Jochen ; et al.	2011-07-14
Semiconductor system having a pn transition and method for manufacturing a semiconductor system Grant 7,199,031 - Lopez , et al. April 3, 2	2007-04-03
Single-phase converter module App 20060124957 - Hornung; Stefan ; et al.	2006-06-15
Soldering method for mounting electric components Grant 6,953,145 - Wolf , et al. October 11, 2	2005-10-11
Semiconductor arrangement comprising a pn-transition and method for producing a semiconductor arrangement App 20050121690 - Lopez, Maria Del Rocio Martin ; et al.	2005-06-09
Method for producing highly doped semiconductor components Grant 6,806,173 - Spitz , et al. October 19, 2	2004-10-19
Soldering method for mounting electric components App 20040011856 - Wolf, Kuno ; et al.	2004-01-22

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