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Offset-aligned three-dimensional integrated circuit
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Optical Die-last Wafer-level Fanout Package With Fiber Attach Capability
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Structural Thermal Interfacing For Lidded Semiconductor Packages
App 20220199429 - SHAH; PRIYAL ; et al. | 2022-06-23 |
Molded chip package with anchor structures
Grant 11,367,628 - Shah , et al. June 21, 2 | 2022-06-21 |
Arrangement And Thermal Management Of 3d Stacked Dies
App 20220059425 - WUU; JOHN ; et al. | 2022-02-24 |
Hybrid Bonded Interconnect Bridging
App 20220052023 - FU; LEI ; et al. | 2022-02-17 |
Mixed Density Interconnect Architectures Using Hybrid Fan-out
App 20220051989 - AGARWAL; RAHUL ; et al. | 2022-02-17 |
Arrangement and thermal management of 3D stacked dies
Grant 11,189,540 - Wuu , et al. November 30, 2 | 2021-11-30 |
Arrangement and thermal management of 3D stacked dies
Grant 11,164,807 - Wuu , et al. November 2, 2 | 2021-11-02 |
Scheme For Enabling Die Reuse In 3d Stacked Products
App 20210098441 - Wuu; John J. ; et al. | 2021-04-01 |
Fan-out Package With Reinforcing Rivets
App 20210057352 - Agarwal; Rahul ; et al. | 2021-02-25 |
Molded Chip Package With Anchor Structures
App 20210020459 - Shah; Priyal ; et al. | 2021-01-21 |
Offset-aligned Three-dimensional Integrated Circuit
App 20200194413 - Wilkerson; Brett P. ; et al. | 2020-06-18 |
Offset-aligned three-dimensional integrated circuit
Grant 10,573,630 - Wilkerson , et al. Feb | 2020-02-25 |
Arrangement And Thermal Management Of 3d Stacked Dies
App 20190393123 - Wuu; John ; et al. | 2019-12-26 |
Arrangement And Thermal Management Of 3d Stacked Dies
App 20190393124 - Wuu; John ; et al. | 2019-12-26 |
Offset-aligned Three-dimensional Integrated Circuit
App 20190326272 - Wilkerson; Brett P. ; et al. | 2019-10-24 |
Arrangement and thermal management of 3D stacked dies
Grant 10,431,517 - Wuu , et al. O | 2019-10-01 |
Stacked Dies And Dummy Components For Improved Thermal Performance
App 20190189590 - Agarwal; Rahul ; et al. | 2019-06-20 |
Stacked dies and dummy components for improved thermal performance
Grant 10,312,221 - Agarwal , et al. | 2019-06-04 |
Arrangement And Thermal Management Of 3d Stacked Dies
App 20190067152 - Wuu; John ; et al. | 2019-02-28 |
Semiconductor devices with compliant interconnects
Grant 9,324,667 - Uehling , et al. April 26, 2 | 2016-04-26 |
Packaged integrated circuit having large solder pads and method for forming
Grant 8,766,453 - Uehling , et al. July 1, 2 | 2014-07-01 |
Packaged Integrated Circuit Having Large Solder Pads And Method For Forming
App 20140117554 - Uehling; Trent S. ; et al. | 2014-05-01 |
Semiconductor package structure having an air gap and method for forming
Grant 8,704,370 - Uehling , et al. April 22, 2 | 2014-04-22 |
Semiconductor Package Structure Having An Air Gap And Method For Forming
App 20140001632 - Uehling; Trent S. ; et al. | 2014-01-02 |
Semiconductor Devices With Compliant Interconnects
App 20130181340 - UEHLING; Trent S. ; et al. | 2013-07-18 |
Die level metal density gradient for improved flip chip package reliability
Grant 7,276,435 - Pozder , et al. October 2, 2 | 2007-10-02 |
Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
Grant 7,247,552 - Pozder , et al. July 24, 2 | 2007-07-24 |
Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
App 20060154470 - Pozder; Scott K. ; et al. | 2006-07-13 |
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