| Patent | Date |
|---|
Installing an Electronic Assembly
App 20220285311 - Heimann; Matthias ; et al. | 2022-09-08 |
Method for mounting an electrical component in which a hood is used, and a hood that is suitable for use in this method
Grant 11,424,170 - Busche , et al. August 23, 2 | 2022-08-23 |
Power module having a power electronics device on a substrate board, and power electronics circuit having such a power module
Grant 11,373,984 - Strogies , et al. June 28, 2 | 2022-06-28 |
Capacitor structure and power module having a power electronic component
Grant 11,373,804 - Meyrath , et al. June 28, 2 | 2022-06-28 |
Soldering Material Based On Sn Ag And Cu
App 20220168851 - Albrecht; Hans-Jurgen ; et al. | 2022-06-02 |
Solder alloy for power devices and solder joint having a high current density
Grant 11,331,759 - Albrecht , et al. May 17, 2 | 2022-05-17 |
Semiconductor component and method for producing same
Grant 11,289,425 - Blank , et al. March 29, 2 | 2022-03-29 |
Solder preform for establishing a diffusion solder connection and method for producing a solder preform
Grant 11,285,568 - Strogies , et al. March 29, 2 | 2022-03-29 |
Soldering material based on Sn Ag and Cu
Grant 11,285,569 - Albrecht , et al. March 29, 2 | 2022-03-29 |
Power electronic circuit having a plurality of power modules
Grant 11,282,822 - Meyrath , et al. March 22, 2 | 2022-03-22 |
Electrical assembly
Grant 11,212,918 - Blank , et al. December 28, 2 | 2021-12-28 |
Circuit Carrier Having an Installation Place for Electronic Components, Electronic Circuit and Production Method
App 20210351151 - Urbahn; Robby ; et al. | 2021-11-11 |
Power Electronic Circuit Having A Plurality Of Power Modules
App 20210242187 - Meyrath; Wilhelm ; et al. | 2021-08-05 |
Connecting Electrical Components
App 20210176885 - POEHLER; Dirk ; et al. | 2021-06-10 |
Vibration-damped Circuit Arrangement, Converter, And Aircraft Having Such An Arrangement
App 20210161002 - Blank; Rene ; et al. | 2021-05-27 |
Power Module Having a Power Electronics Device on a Substrate Board, and Power Electronics Circuit Having Such a Power Module
App 20210151417 - Strogies; Jorg ; et al. | 2021-05-20 |
Creation Of An Electrical Connection Between Components And A Contacting Plate
App 20210098974 - POEHLER; Dirk ; et al. | 2021-04-01 |
Capacitor Structure and Power Module Having a Power Electronic Component
App 20210090798 - Meyrath; Wilhelm ; et al. | 2021-03-25 |
Circuit Arrangement Having A Spacer Element, Converter And Aircraft With Such A Circuit Arrangement, And Method For Current Measurement
App 20210021179 - Blank; Rene ; et al. | 2021-01-21 |
Solder Alloy for Power Devices and Solder Joint Having a High Current Density
App 20210008670 - Albrecht; Hans-Jurgen ; et al. | 2021-01-14 |
Electrical Assembly
App 20200170111 - Blank; Rene ; et al. | 2020-05-28 |
Semiconductor Component and Method for Producing Same
App 20200161246 - Blank; Rene ; et al. | 2020-05-21 |
Solder Preform for Establishing a Diffusion Solder Connection and Method for Producing a Solder Preform
App 20200147731 - Strogies; Jorg ; et al. | 2020-05-14 |
Electronic Assembly With a Component Located Between Two Substrates, and Method for Producing Same
App 20200152532 - Blank; Rene ; et al. | 2020-05-14 |
Solder Preform for Diffusion Soldering, Method for the Production thereof, and Method for the Assembly Thereof
App 20200139490 - Strogies; Jorg ; et al. | 2020-05-07 |
Tolerance Compensation Element For Circuit Configurations
App 20200122450 - BLANK; Rene ; et al. | 2020-04-23 |
Soldering Material Based On Sn Ag And Cu
App 20200023472 - Albrecht; Hans-Jurgen ; et al. | 2020-01-23 |
Electronic assembly with a component arranged between two circuit carriers, and method for joining such an assembly
Grant 10,420,220 - Bigl , et al. Sept | 2019-09-17 |
Soldering material based on Sn Ag and Cu
Grant 10,376,994 - Albrecht , et al. A | 2019-08-13 |
Electronic Assembly With A Component Arranged Between Two Circuit Carriers, and Method For Joining Such An Assembly
App 20190191566 - BIGL; Thomas ; et al. | 2019-06-20 |
Method for mounting an electrical component, wherein a hood is used, and hood suitable for use in said method
Grant 10,008,394 - Busche , et al. June 26, 2 | 2018-06-26 |
Method for the diffusion soldering of an electronic component to a substrate
Grant 10,004,147 - Strogies , et al. June 19, 2 | 2018-06-19 |
Method For Mounting An Electrical Component, Wherein A Hood Is Used, And Hood Suitable For Use In Said Method
App 20170117162 - BUSCHE; Nora ; et al. | 2017-04-27 |
Method For Mounting An Electrical Component In Which A Hood Is Used, And A Hood That Is Suitable For Use In This Method
App 20170033024 - Busche; Nora ; et al. | 2017-02-02 |
Diffusion Soldering Method Using The Formation Of A Diffusion Zone As A Solder Connection, And Electronic Assembly With Such A Solder Connection
App 20160219720 - Strogies; Joerg ; et al. | 2016-07-28 |
Solder Alloy for Power Devices and Solder Joint Having a High Current Density
App 20140112710 - Albrecht; Hans-Jurgen ; et al. | 2014-04-24 |
Soldering material based on sn ag and cu
App 20070036671 - Albrecht; Hans-Jurgen ; et al. | 2007-02-15 |
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