Patent | Date |
---|
Mask shrink layer for high aspect ratio dielectric etch Grant 10,431,458 - Hudson , et al. O | 2019-10-01 |
Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch Grant 10,170,323 - Hudson , et al. J | 2019-01-01 |
Electrostatic Chuck With Flexible Wafer Temperature Control App 20180286642 - MATYUSHKIN; Alexander ;   et al. | 2018-10-04 |
Technique To Deposit Metal-containing Sidewall Passivation For High Aspect Ratio Cylinder Etch App 20170170026 - Hudson; Eric A. ;   et al. | 2017-06-15 |
Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch Grant 9,620,377 - Hudson , et al. April 11, 2 | 2017-04-11 |
Mask Shrink Layer For High Aspect Ratio Dielectric Etch App 20170076945 - Hudson; Eric A. ;   et al. | 2017-03-16 |
Mask shrink layer for high aspect ratio dielectric etch Grant 9,543,148 - Hudson , et al. January 10, 2 | 2017-01-10 |
Technique To Deposit Metal-containing Sidewall Passivation For High Aspect Ratio Cylinder Etch App 20160163558 - Hudson; Eric A. ;   et al. | 2016-06-09 |
Method and apparatus for pattern collapse free wet processing of semiconductor devices Grant 8,440,573 - Mikhaylichenko , et al. May 14, 2 | 2013-05-14 |
Methods for Using Proximity Head With Configurable Delivery App 20120199164 - Wilcoxson; Mark H. ;   et al. | 2012-08-09 |
Apparatus for isolated bevel edge clean and method for using the same Grant 8,127,395 - Yoon , et al. March 6, 2 | 2012-03-06 |
Method And Apparatus For Pattern Collapse Free Wet Processing Of Semiconductor Devices App 20110183522 - Mikhaylichenko; Katrina ;   et al. | 2011-07-28 |
Apparatus for isolated bevel edge clean and method for using the same App 20090113656 - Yoon; Hyungsuk Alexander ;   et al. | 2009-05-07 |
Proximity Head With Configurable Delivery App 20080149147 - Wilcoxson; Mark H. ;   et al. | 2008-06-26 |
Plasma in-situ treatment of chemically amplified resist Grant 7,347,915 - Keil , et al. March 25, 2 | 2008-03-25 |
Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition Grant 7,294,580 - Yun , et al. November 13, 2 | 2007-11-13 |
Plasma in-situ treatment of chemically amplified resist Grant 7,022,611 - Keil , et al. April 4, 2 | 2006-04-04 |
Materials and gas chemistries for processing systems App 20060011583 - Bailey; Andrew D. III ;   et al. | 2006-01-19 |
Method for producing a semiconductor device Grant 6,873,112 - Wilcoxson , et al. March 29, 2 | 2005-03-29 |
Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition App 20040224520 - Yun, Seokmin ;   et al. | 2004-11-11 |
Method for producing a semiconductor device App 20040216676 - Wilcoxson, Mark H. ;   et al. | 2004-11-04 |
Antenna for producing uniform process rates Grant 6,744,213 - Wilcoxson , et al. June 1, 2 | 2004-06-01 |
Materials and gas chemistries for processing systems App 20040011467 - Hemker, David J. ;   et al. | 2004-01-22 |
Antenna for producing uniform process rates App 20030189524 - Wilcoxson, Mark H. ;   et al. | 2003-10-09 |
Plasma Processing System With Dynamic Gas Distribution Control App 20030155079 - BAILEY, ANDREW D. III ;   et al. | 2003-08-21 |
Method and apparatus for producing uniform process rates App 20030145952 - Wilcoxson, Mark H. ;   et al. | 2003-08-07 |
Method and apparatus for producing uniform process rates Grant 6,518,705 - Wilcoxson , et al. February 11, 2 | 2003-02-11 |
Method And Apparatus For Producing Uniform Process Rates App 20020175869 - Wilcoxson, Mark H. ;   et al. | 2002-11-28 |