Wilby; John L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wilby; John L..The latest application filed is for "thick film packages with common wafer aperture placement".
- Wilby; John L. - Ottawa CA
- Wilby; John L. - Wirral GB2
| Patent | Date |
|---|---|
| Thick film packages with common wafer aperture placement Grant 4,943,845 - Wilby July 24, 1 | 1990-07-24 |
| Fabric softening composition and a process for preparing it from cationic surfactant and thickener Grant 4,379,059 - Hockey , et al. April 5, 1 | 1983-04-05 |
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