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Patent applications and USPTO patent grants for Wihl; Tim S..The latest application filed is for "coordinate fusion and thickness calibration for semiconductor wafer edge inspection".
Patent | Date |
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Coordinate fusion and thickness calibration for semiconductor wafer edge inspection Grant 8,629,902 - Lewis , et al. January 14, 2 | 2014-01-14 |
Coordinate Fusion And Thickness Calibration For Semiconductor Wafer Edge Inspection App 20120086796 - Lewis; Isabella T. ;   et al. | 2012-04-12 |
Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems Grant 4,805,123 - Specht , et al. February 14, 1 | 1989-02-14 |
Process and apparatus for in-situ qualification of master patterns used in patterning systems Grant 4,758,094 - Wihl , et al. July 19, 1 | 1988-07-19 |
Photomask inspection apparatus and method using corner comparator defect detection algorithm Grant 4,532,650 - Wihl , et al. July 30, 1 | 1985-07-30 |
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