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Patent applications and USPTO patent grants for Wi; Sung-rey.The latest application filed is for "semiconductor device structure with strain layer and method of fabricating the semiconductor device structure".
Patent | Date |
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Semiconductor device structure with strain layer Grant 8,350,354 - Lee , et al. January 8, 2 | 2013-01-08 |
Semiconductor Device Structure With Strain Layer And Method Of Fabricating The Semiconductor Device Structure App 20110062497 - Lee; Seung-hwan ;   et al. | 2011-03-17 |
Electronic fuse having heat spreading structure Grant 7,888,772 - Kwon , et al. February 15, 2 | 2011-02-15 |
Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure Grant 7,863,152 - Lee , et al. January 4, 2 | 2011-01-04 |
Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure App 20080246092 - Lee; Seung-hwan ;   et al. | 2008-10-09 |
Electronic Fuse Having Heat Spreading Structure App 20080211059 - KWON; Dae-Jin ;   et al. | 2008-09-04 |
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