WI; Kyoung Tae

Patent Applications and Registrations

Patent applications and USPTO patent grants for WI; Kyoung Tae.The latest application filed is for "adhesive composition for a semiconductor, adhesive film prepared from the composition, and semiconductor device connected by the film".

Company Profile

0.2.8

WI; Kyoung Tae - Uiwang-si KR
Wi; Kyoung Tae - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive Composition For A Semiconductor, Adhesive Film Prepared From The Composition, And Semiconductor Device Connected By The Film App 20140186607 - WI; Kyoung Tae ; et al.	2014-07-03
Adhesive Composition And Adhesive Film Comprising The Same App 20130165603 - WI; Kyoung Tae ; et al.	2013-06-27
Adhesive Composition For Semiconductor And Adhesive Film Comprising The Same App 20130143363 - KIM; Sang Jin ; et al.	2013-06-06
Reacting functionalized trialkoxysilane with polyepoxide or diamine to yield silane adduct Grant 7,408,015 - Kang , et al. August 5, 2	2008-08-05
Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same Grant 7,105,625 - Kang , et al. September 12, 2	2006-09-12
Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same App 20060094848 - Kang; Byoung Un ; et al.	2006-05-04
Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same App 20040216840 - Kang, Byoung Un ; et al.	2004-11-04

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