Whitten; Kyle
Patent Applications and Registrations
Patent applications and USPTO patent grants for Whitten; Kyle.The latest application filed is for "cobalt chemistry for smooth topology".
- Whitten; Kyle - Hamden CT
- Whitten; Kyle - Cheshire CT
- Whitten; Kyle - Waterbury CT
- Whitten; Kyle - West Haven CT
| Patent | Date |
|---|---|
| Cobalt filling of interconnects in microelectronics Grant 11,434,578 - Commander , et al. September 6, 2 | 2022-09-06 |
| Cobalt filling of interconnects Grant 11,401,618 - Commander , et al. August 2, 2 | 2022-08-02 |
| Cobalt Chemistry For Smooth Topology App 20220136123 - Sun; Shaopeng ; et al. | 2022-05-05 |
| Composition and Method for Fabrication of Nickel Interconnects App 20220064811 - Yakobson; Eric ; et al. | 2022-03-03 |
| Cobalt chemistry for smooth topology Grant 11,230,778 - Sun , et al. January 25, 2 | 2022-01-25 |
| Copper Deposition in Wafer Level Packaging of Integrated Circuits App 20210388519 - Richardson; Thomas ; et al. | 2021-12-16 |
| Leveler compositions for use in copper deposition in manufacture of microelectronics Grant 11,168,406 - Paneccasio , et al. November 9, 2 | 2021-11-09 |
| Cobalt Filling of Interconnects App 20210332491 - Commander; John ; et al. | 2021-10-28 |
| Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics App 20210310141 - Paneccasio, JR.; Vincent ; et al. | 2021-10-07 |
| Copper deposition in wafer level packaging of integrated circuits Grant 11,124,888 - Richardson , et al. September 21, 2 | 2021-09-21 |
| Cobalt Filling of Interconnects in Microelectronics App 20210222314 - Commander; John ; et al. | 2021-07-22 |
| Cobalt Chemistry For Smooth Topology App 20210180200 - Sun; Shaopeng ; et al. | 2021-06-17 |
| Cobalt filling of interconnects Grant 11,035,048 - Commander , et al. June 15, 2 | 2021-06-15 |
| Cobalt filling of interconnects in microelectronics Grant 10,995,417 - Commander , et al. May 4, 2 | 2021-05-04 |
| Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics App 20200063280 - Paneccasio; Vincent ; et al. | 2020-02-27 |
| Cobalt Filling of Interconnects in Microelectronics App 20200040478 - Commander; John ; et al. | 2020-02-06 |
| Leveler compositions for use in copper deposition in manufacture of microelectronics Grant 10,519,557 - Paneccasio, Jr. , et al. Dec | 2019-12-31 |
| Copper Electrodeposition in Microelectronics App 20190390356 - Paneccasio, Jr.; Vincent ; et al. | 2019-12-26 |
| Copper Deposition in Wafer Level Packaging of Integrated Circuits App 20190368064 - Richardson; Thomas ; et al. | 2019-12-05 |
| Levelers for copper deposition in microelectronics Grant 10,294,574 - Whitten , et al. | 2019-05-21 |
| Cobalt Filling of Interconnects App 20190010624 - Commander; John ; et al. | 2019-01-10 |
| Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics App 20170233883 - Paneccasio, JR.; Vincent ; et al. | 2017-08-17 |
| Electrodeposition of Copper App 20160281251 - Paneccasio; Vincent ; et al. | 2016-09-29 |
| Levelers For Copper Deposition In Microelectronics App 20160076160 - Whitten; Kyle ; et al. | 2016-03-17 |
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