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Patent applications and USPTO patent grants for White; Wade H..The latest application filed is for "screw attachment system for electronic assemblies".
Patent | Date |
---|---|
Screw attachment system for electronic assemblies Grant 10,076,053 - Genest , et al. September 11, 2 | 2018-09-11 |
Latch and spring assembly Grant 10,019,028 - Loparco , et al. July 10, 2 | 2018-07-10 |
Latch and spring assembly Grant 9,547,334 - Loparco , et al. January 17, 2 | 2017-01-17 |
Screw Attachment System For Electronic Assemblies App 20160309609 - Genest; Robert R. ;   et al. | 2016-10-20 |
Screw attachment system for electronic assemblies Grant 9,426,924 - Genest , et al. August 23, 2 | 2016-08-23 |
Latch And Spring Assembly App 20160219745 - Loparco; John J. ;   et al. | 2016-07-28 |
Screw Attachment System For Electronic Assemblies App 20160219747 - Genest; Robert R. ;   et al. | 2016-07-28 |
Latch And Spring Assembly App 20160219744 - Loparco; John J. ;   et al. | 2016-07-28 |
Positive pressure-applying compliant latch mechanism Grant 8,953,332 - Canfield , et al. February 10, 2 | 2015-02-10 |
Positive Pressure-applying Compliant Latch Mechanism App 20130265695 - CANFIELD; Shawn ;   et al. | 2013-10-10 |
Cooling A Multi-chip Electronic Module App 20130033820 - Edwards; David L. ;   et al. | 2013-02-07 |
Heat Spreader For Multi-chip Modules App 20130027885 - Edwards; David L. ;   et al. | 2013-01-31 |
Removable cooling duct with interlocking dovetail connections for an air tight thermal seal Grant 7,660,111 - Barringer , et al. February 9, 2 | 2010-02-09 |
Removable Cooling Duct With Interlocking Dovetail Connections For An Air Tight Thermal Seal App 20090141442 - Barringer; Dennis R. ;   et al. | 2009-06-04 |
System and method for insertion, retention and extraction of a card-let printed circuit board, without protective hardware into and from a motherboard App 20070058354 - Scanlon; Michael F. ;   et al. | 2007-03-15 |
Fixture for securing hard stops to a substrate App 20020092594 - Barringer, Dennis ;   et al. | 2002-07-18 |
System and method for a self aligning multiple card enclosure with hot plug capability Grant 6,421,252 - White , et al. July 16, 2 | 2002-07-16 |
Segmented architecture for wafer test & burn-in App 20010050567 - Bachelder, Thomas W. ;   et al. | 2001-12-13 |
Segmented architecture for wafer test and burn-in Grant 6,275,051 - Bachelder , et al. August 14, 2 | 2001-08-14 |
Mechanical fixture for holding electronic devices under test showing adjustments in multiple degrees of freedom Grant 6,262,582 - Barringer , et al. July 17, 2 | 2001-07-17 |
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