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Patent applications and USPTO patent grants for White; Robert F..The latest application filed is for "packaging reliability superchips".
Patent | Date |
---|---|
Packaging reliability superchips Grant 7,560,950 - Blanchet , et al. July 14, 2 | 2009-07-14 |
Packaging reliability superchips App 20080088335 - Blanchet; Jason E. ;   et al. | 2008-04-17 |
Packaging reliability super chips Grant 7,348,792 - Blanchet , et al. March 25, 2 | 2008-03-25 |
Packaging reliability super chips App 20060290372 - Blanchet; Jason E. ;   et al. | 2006-12-28 |
Extension of fatigue life for C4 solder ball to chip connection Grant 7,119,003 - Bernier , et al. October 10, 2 | 2006-10-10 |
Packaging reliability superchips Grant 7,102,377 - Blanchet , et al. September 5, 2 | 2006-09-05 |
Extension of fatigue life for C4 solder ball to chip connection Grant 7,067,916 - Bernier , et al. June 27, 2 | 2006-06-27 |
Extension of fatigue life for C4 solder ball to chip connection App 20050224973 - Bernier, William E. ;   et al. | 2005-10-13 |
Extension of fatigue life for C4 solder ball to chip connection App 20020195707 - Bernier, William E. ;   et al. | 2002-12-26 |
Engine mount Grant 4,097,011 - White June 27, 1 | 1978-06-27 |
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