Whang; Tsung Chuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Whang; Tsung Chuan.The latest application filed is for "assembly structure for connecting multiple dies into a system-in-package chip and the method thereof".
- Whang; Tsung Chuan - Cupertino CA US
| Patent | Date |
|---|---|
| Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof Grant 9,349,610 - Whang , et al. May 24, 2 | 2016-05-24 |
| Assembly Structure For Connecting Multiple Dies Into A System-in-package Chip And The Method Thereof App 20150311094 - Whang; Tsung Chuan ; et al. | 2015-10-29 |
| Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof Grant 9,111,846 - Whang , et al. August 18, 2 | 2015-08-18 |
| Variable-delay signal generators and methods of operation therefor Grant 6,970,029 - Patel , et al. November 29, 2 | 2005-11-29 |
| Variable-delay signal generators and methods of operation therefor App 20050140417 - Patel, Bheem ; et al. | 2005-06-30 |
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