West; R. Scott

Patent Applications and Registrations

Patent applications and USPTO patent grants for West; R. Scott.The latest application filed is for "light emitting diode constructions and methods for making the same".

Company Profile

4.36.38

West; R. Scott - Pleasanton CA
West; R. Scott - Morgan Hill CA
West; R. Scott - Wixom MI
West, R. Scott - Elliot ME

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light Emitting Diode Constructions And Methods For Making The Same App 20220262994 - Odnoblyudov; Vladimir A. ; et al.	2022-08-18
Packaging photon building blocks with top side connections and interconnect structure Grant 11,411,152 - West August 9, 2	2022-08-09
Light emitting diode constructions and methods for making the same Grant 11,245,058 - Odnoblyudov , et al. February 8, 2	2022-02-08
Packaging Photon Building Blocks With Top Side Connections And Interconnect Structure App 20210126175 - West; R. Scott	2021-04-29
Packaging photon building blocks with top side connections and interconnect structure Grant 10,840,424 - West November 17, 2	2020-11-17
Packaging Photon Building Blocks With Top Side Connections And Interconnect Structure App 20200035888 - West; R. Scott	2020-01-30
Light Emitting Diode Constructions And Methods For Making The Same App 20190341534 - Odnoblyudov; Vladimir A. ; et al.	2019-11-07
Packaging photon building blocks with top side connections and interconnect structure Grant 10,347,807 - West July 9, 2	2019-07-09
Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate Grant 10,325,890 - West , et al.	2019-06-18
Light emitting diode constructions and methods for making the same Grant 10,297,731 - Odnoblyudov , et al.	2019-05-21
Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the Substrate App 20180247921 - West; R. Scott ; et al.	2018-08-30
Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate Grant 9,985,004 - West , et al. May 29, 2	2018-05-29
Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate Grant 9,893,039 - West , et al. February 13, 2	2018-02-13
LED-based light source utilizing asymmetric conductors Grant 9,893,243 - West , et al. February 13, 2	2018-02-13
Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the Substrate App 20170338209 - West; R. Scott ; et al.	2017-11-23
Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the Substrate App 20170221865 - West; R. Scott ; et al.	2017-08-03
Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate Grant 9,653,437 - West , et al. May 16, 2	2017-05-16
LED lens design with more uniform color-over-angle emission Grant 9,595,645 - Tong , et al. March 14, 2	2017-03-14
Jetting a Highly Reflective Layer Onto an LED Assembly App 20170018539 - West; R. Scott	2017-01-19
LED-Based Light Source Utilizing Asymmetric Conductors App 20170018687 - West; R. Scott ; et al.	2017-01-19
LED-based light source utilizing asymmetric conductors Grant 9,478,719 - West , et al. October 25, 2	2016-10-25
LED array member and integrated control module assembly having active circuitry Grant 9,468,052 - Gershowitz , et al. October 11, 2	2016-10-11
Jetting a highly reflective layer onto an LED assembly Grant 9,461,023 - West October 4, 2	2016-10-04
Low-profile outdoor lighting module with light emitting diodes Grant 9,439,299 - Tudhope , et al. September 6, 2	2016-09-06
Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the Substrate App 20160197061 - West; R. Scott ; et al.	2016-07-07
LED Lens Design with More Uniform Color-Over-Angle Emission App 20160172551 - Tong; Tao ; et al.	2016-06-16
Light Emitting Diode Constructions And Methods For Making The Same App 20160149100 - Odnoblyudov; Vladimir A. ; et al.	2016-05-26
Packaging photon building blocks having only top side connections in a molded interconnect structure Grant 9,312,465 - West , et al. April 12, 2	2016-04-12
LED lens design with more uniform color-over-angle emission Grant 9,276,177 - Tong , et al. March 1, 2	2016-03-01
LED array member and thermally decoupled integrated control module assembly Grant 9,247,594 - Gershowitz , et al. January 26, 2	2016-01-26
LED Array Member and Integrated Control Module Assembly Having Active Circuitry App 20150377466 - Gershowitz; Michael Neal ; et al.	2015-12-31
Using An LED Die To Measure Temperature Inside Silicone That Encapsulates An LED Array App 20150355032 - Imangholi; Babak ; et al.	2015-12-10
Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure App 20150333045 - West; R. Scott ; et al.	2015-11-19
Using an LED die to measure temperature inside silicone that encapsulates an LED array Grant 9,164,001 - Imangholi , et al. October 20, 2	2015-10-20
LED array member and integrated control module assembly having active circuitry Grant 9,155,145 - Gershowitz , et al. October 6, 2	2015-10-06
Low-Profile Outdoor Lighting Module With Light Emitting Diodes App 20150276144 - Tudhope; Robert ; et al.	2015-10-01
LED Lens Design with More Uniform Color-Over-Angle Emission App 20150255687 - Tong; Tao ; et al.	2015-09-10
Packaging photon building blocks having only top side connections in a molded interconnect structure Grant 9,130,139 - West , et al. September 8, 2	2015-09-08
LED lens design with more uniform color-over-angle emission Grant 9,065,024 - Tong , et al. June 23, 2	2015-06-23
LED Array Member and Integrated Control Module Assembly Having Active Circuitry App 20150054406 - Gershowitz; Michael Neal ; et al.	2015-02-26
Using an LED die to measure temperature inside silicone that encapsulates an LED array Grant 8,941,129 - Gershowitz , et al. January 27, 2	2015-01-27
LED Array Member and Thermally Decoupled Integrated Control Module Assembly App 20150022088 - Gershowitz; Michael Neal ; et al.	2015-01-22
Using An LED Die To Measure Temperature Inside Silicone That Encapsulates An LED Array App 20150021629 - Gershowitz; Michael Neal ; et al.	2015-01-22
Using An LED Die To Measure Temperature Inside Silicone That Encapsulates An LED Array App 20150002023 - Imangholi; Babak ; et al.	2015-01-01
Micro-bead blasting process for removing a silicone flash layer Grant 8,803,180 - West , et al. August 12, 2	2014-08-12
Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure App 20140131747 - West; R. Scott ; et al.	2014-05-15
Micro-Bead Blasting Process for Removing a Silicone Flash Layer App 20140048832 - West; R. Scott ; et al.	2014-02-20
Packaging photon building blocks having only top side connections in a molded interconnect structure Grant 8,652,860 - West , et al. February 18, 2	2014-02-18
Micro-bead Blasting Process For Removing A Silicone Flash Layer App 20130337592 - West; R. Scott ; et al.	2013-12-19
Micro-bead blasting process for removing a silicone flash layer Grant 8,610,153 - West , et al. December 17, 2	2013-12-17
LED Lens Design with More Uniform Color-Over-Angle Emission App 20130292709 - Tong; Tao ; et al.	2013-11-07
Micro-bead blasting process for removing a silicone flash layer Grant 8,536,605 - West , et al. September 17, 2	2013-09-17
Micro-Bead Blasting Process for Removing a Silicone Flash Layer App 20130134459 - West; R. Scott ; et al.	2013-05-30
Packaging Photon Building Blocks With Top Side Connections And Interconnect Structure App 20130113016 - West; R. Scott	2013-05-09
Jetting A Highly Reflective Layer Onto An Led Assembly App 20130105837 - West; R. Scott	2013-05-02
Packaging photon building blocks having only top side connections in an interconnect structure Grant 8,354,684 - West January 15, 2	2013-01-15
Packaging Photon Building Blocks Having Only Top Side Connections in a Molded Interconnect Structure App 20120187430 - West; R. Scott ; et al.	2012-07-26
Packaging Photon Building Blocks Having Only Top Side Connections in an Interconnect Structure App 20120175643 - WEST; R. SCOTT	2012-07-12
LED-Based Light Source Utilizing Asymmetric Conductors App 20120112220 - West; R. Scott ; et al.	2012-05-10
Light Emitting Devices with Improved Light Extraction Efficiency App 20080006840 - Camras; Michael D. ; et al.	2008-01-10
Light emitting devices with improved light extraction efficiency Grant 7,276,737 - Camras , et al. October 2, 2	2007-10-02
Light emitting devices with improved light extraction efficiency App 20060118805 - Camras; Michael D. ; et al.	2006-06-08
Axial LED source Grant 7,048,412 - Martin , et al. May 23, 2	2006-05-23
Light emitting devices with improved light extraction efficiency Grant 7,009,213 - Camras , et al. March 7, 2	2006-03-07
Light emitting devices with improved light extraction efficiency App 20050023545 - Camras, Michael D. ; et al.	2005-02-03
Axial LED source App 20030227774 - Martin, Paul S. ; et al.	2003-12-11
Debris collecting device and method App 20030200728 - West, R. Scott ; et al.	2003-10-30

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