West; Jeffrey A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for West; Jeffrey A..The latest application filed is for "high voltage isolation barrier with electric overstress integrity".

Company Profile

9.35.39

West; Jeffrey A. - Dallas TX
- DALLAS TX US
West; Jeffrey A. - San Jose CA
West; Jeffrey A - Dallas TX US
West; Jeffrey A. - Bellville OH
West; Jeffrey A. - San Antonio TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High Voltage Isolation Barrier With Electric Overstress Integrity App 20220254740 - West; Jeffrey A.	2022-08-11
High voltage isolation barrier with electric overstress integrity Grant 11,348,883 - West May 31, 2	2022-05-31
High Voltage Isolation Barrier With Electric Overstress Integrity App 20210305178 - West; Jeffrey A.	2021-09-30
Crack Suppression Structure For Hv Isolation Component App 20210280533 - STEWART; ELIZABETH COSTNER ; et al.	2021-09-09
Generating multi-focal defect maps using optical tools Grant 11,087,451 - Stewart , et al. August 10, 2	2021-08-10
Scribe seals and methods of making Grant 11,069,627 - Bonifield , et al. July 20, 2	2021-07-20
Crack suppression structure for HV isolation component Grant 11,049,820 - Stewart , et al. June 29, 2	2021-06-29
Integrated Capacitor With Sidewall Having Reduced Roughness App 20210143249 - STEWART; ELIZABETH COSTNER ; et al.	2021-05-13
Integrated capacitor with sidewall having reduced roughness Grant 10,978,548 - Stewart , et al. April 13, 2	2021-04-13
Structure and method for improving high voltage breakdown reliability of a microelectronic device Grant 10,679,935 - West , et al.	2020-06-09
Oxidation resistant barrier metal process for semiconductor devices Grant 10,665,543 - West , et al.	2020-05-26
Crack Suppression Structure For Hv Isolation Component App 20200035617A1 -	2020-01-30
Structure And Method For Improving High Voltage Breakdown Reliability Of A Microelectronic Device App 20200013713 - West; Jeffrey A. ; et al.	2020-01-09
Hybrid High and Low Stress Oxide Embedded Capacitor Dielectric App 20190378892 - Stewart; Elizabeth Costner ; et al.	2019-12-12
Structure and method for improving high voltage breakdown reliability of a microelectronic device Grant 10,418,320 - West , et al. Sept	2019-09-17
Generating Multi-focal Defect Maps Using Optical Tools App 20190188839 - STEWART; Elizabeth C. ; et al.	2019-06-20
Structure And Method For Improving High Voltage Breakdown Reliability Of A Microelectronic Device App 20190006276 - West; Jeffrey A. ; et al.	2019-01-03
Oxidation Resistant Barrier Metal Process For Semiconductor Devices App 20180308802 - West; Jeffrey A. ; et al.	2018-10-25
Structure and method for improving high voltage breakdown reliability of a microelectronic device Grant 10,109,574 - West , et al. October 23, 2	2018-10-23
Structure And Method For Improving High Voltage Breakdown Reliability Of A Microelectronic Device App 20180286802 - West; Jeffrey A. ; et al.	2018-10-04
Oxidation resistant barrier metal process for semiconductor devices Grant 10,008,450 - West , et al. June 26, 2	2018-06-26
Integrated Capacitor With Sidewall Having Reduced Roughness App 20180130870 - STEWART; ELIZABETH COSTNER ; et al.	2018-05-10
Secure credential storage Grant 9,910,997 - Brail , et al. March 6, 2	2018-03-06
Oxidation Resistant Barrier Metal Process For Semiconductor Devices App 20170271269 - West; Jeffrey A. ; et al.	2017-09-21
Oxidation resistant barrier metal process for semiconductor devices Grant 9,704,804 - West , et al. July 11, 2	2017-07-11
Oxidation Resistant Barrier Metal Process For Semiconductor Devices App 20170179033 - West; Jeffrey A. ; et al.	2017-06-22
Scribe Seals And Methods Of Making App 20160133580 - Bonifield; Thomas D. ; et al.	2016-05-12
Electronic assemblies including mechanically secured protruding bonding conductor joints Grant 8,859,414 - West October 14, 2	2014-10-14
Post-Polymer Revealing of Through-Substrate Via Tips App 20140154880 - Brighton; Jeffrey E. ; et al.	2014-06-05
Protective layer for protecting TSV tips during thermo-compressive bonding Grant 8,723,330 - West May 13, 2	2014-05-13
Integrated Circuit (ic) Having Tsvs And Stress Compensating Layer App 20130249011 - CHOI; YOUN SUNG ; et al.	2013-09-26
DEVICE HAVING TSVs WITH GETTERING LAYER LATERAL TO TSV TIPS App 20130113103 - WEST; JEFFREY A. ; et al.	2013-05-09
Post-polymer Revealing Of Through-substrate Via Tips App 20130062736 - BRIGHTON; JEFFREY E. ; et al.	2013-03-14
Integrated circuit (IC) having TSVS with dielectric crack suppression structures Grant 8,378,495 - West February 19, 2	2013-02-19
Non-contact determination of joint integrity between a TSV die and a package substrate Grant 8,378,701 - West February 19, 2	2013-02-19
Integrated circuits having TSVs including metal gettering dielectric liners Grant 8,304,893 - West November 6, 2	2012-11-06
IC devices having TSVS including protruding tips having IMC blocking tip ends Grant 8,299,612 - West , et al. October 30, 2	2012-10-30
Protruding TSV tips for enhanced heat dissipation for IC devices Grant 8,294,261 - Mawatari , et al. October 23, 2	2012-10-23
Ic Devices Having Tsvs Including Protruding Tips Having Imc Blocking Tip Ends App 20120235296 - West; Jeffrey A. ; et al.	2012-09-20
Electronic Assemblies Including Mechanically Secured Protruding Bonding Conductor Joints App 20120149155 - West; Jeffrey A.	2012-06-14
Non-contact Determination Of Joint Integrity Between A Tsv Die And A Package Substrate App 20120080595 - West; Jeffrey A.	2012-04-05
Electronic assemblies including mechanically secured protruding bonding conductor joints Grant 8,143,704 - West March 27, 2	2012-03-27
Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices Grant 8,125,053 - West , et al. February 28, 2	2012-02-28
Ic Having Dielectric Polymeric Coated Protruding Features Having Wet Etched Exposed Tips App 20110291263 - West; Jeffrey A.	2011-12-01
IC devices having TSVS including protruding tips having IMC blocking tip ends Grant 8,039,385 - West , et al. October 18, 2	2011-10-18
Protruding Tsv Tips For Enhanced Heat Dissipation For Ic Devices App 20110186990 - Mawatari; Kazuaki ; et al.	2011-08-04
Integrated Circuits Having TSVS Including Metal Gettering Dielectric Liners App 20110187000 - WEST; Jeffrey A.	2011-08-04
Integrated circuits having TSVs including metal gettering dielectric liners Grant 7,943,514 - West May 17, 2	2011-05-17
Electronic Assemblies Including Mechanically Secured Protruding Bonding Conductor Joints App 20110079916 - WEST; JEFFREY A.	2011-04-07
Integrated Circuits Having Tsvs Including Metal Gettering Dielectric Liners App 20110049717 - WEST; JEFFREY A.	2011-03-03
Integrated Circuit (ic) Having Tsvs With Dielectric Crack Suppression Structures App 20110031581 - WEST; JEFFREY A.	2011-02-10
Embedded Scribe Lane Crack Arrest Structure For Improved Ic Package Reliability Of Plastic Flip Chip Devices App 20100193918 - West; Jeffrey A. ; et al.	2010-08-05
Methods of minimizing temperature cross-sensitivity in vapor sensors and compositions therefor Grant 7,708,947 - West , et al. May 4, 2	2010-05-04
Environmental Die Seal Enhancement For Wafer Level Chip Scale Packages App 20100078769 - WEST; Jeffrey A. ; et al.	2010-04-01
Method For Improving Electromigration Lifetime For Cu Interconnect Systems App 20090170305 - West; Jeffrey A. ; et al.	2009-07-02
Gas-Fired Heating Appliance Having a Flammable Vapor Sensor Control Device App 20090004612 - West; Jeffrey A.	2009-01-01
Method for improving reliability of copper interconnects Grant 7,309,651 - West , et al. December 18, 2	2007-12-18
Temperature compensated vapor sensor Grant 7,265,560 - West , et al. September 4, 2	2007-09-04
Temperature compensated vapor sensor App 20070117207 - West; Jeffrey A. ; et al.	2007-05-24
Methods of minimizing temperature cross-sensitivity in vapor sensors and compositions therefor App 20070095678 - West; Jeffrey A. ; et al.	2007-05-03
Method for improving reliability of copper interconnects App 20050095843 - West, Jeffrey A. ; et al.	2005-05-05
Scribe street seals in semiconductor devices and method of fabrication Grant 6,841,455 - West , et al. January 11, 2	2005-01-11
PTC conductive composition containing a low molecular weight polyethylene processing aid Grant 6,620,343 - Blok , et al. September 16, 2	2003-09-16
Flue Pipe Control App 20030127061 - Khadkikar, Prasad S. ; et al.	2003-07-10
Scribe street seals in semiconductor devices and method of fabrication App 20030122220 - West, Jeffrey A. ; et al.	2003-07-03
Flue pipe control Grant 6,584,940 - Khadkikar , et al. July 1, 2	2003-07-01
Scribe street seals in semiconductor devices and method of fabrication Grant 6,521,975 - West , et al. February 18, 2	2003-02-18
Conductive polymer compositions containing fibrillated fibers and devices Grant 6,197,220 - Blok , et al. March 6, 2	2001-03-06
PTC device Grant 5,691,688 - West , et al. November 25, 1	1997-11-25

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