loadpatents
Patent applications and USPTO patent grants for Wert; Kevin L..The latest application filed is for "porous media cold plate".
Patent | Date |
---|---|
Porous media cold plate Grant 8,397,796 - Thayer , et al. March 19, 2 | 2013-03-19 |
Porous Media Cold Plate App 20100181056 - Thayer; John G. ;   et al. | 2010-07-22 |
Porous media cold plate Grant 7,690,419 - Thayer , et al. April 6, 2 | 2010-04-06 |
Flexible Loop Thermosyphon App 20060254753 - Phillips; Alfred L. ;   et al. | 2006-11-16 |
Hybrid loop heat pipe Grant 7,111,394 - Wert September 26, 2 | 2006-09-26 |
Heat Pipe Component Deployed From A Compact Volume App 20060201654 - Wert; Kevin L. | 2006-09-14 |
Flexible loop thermosyphon Grant 7,096,928 - Phillips , et al. August 29, 2 | 2006-08-29 |
Porous Media Cold Plate App 20060185823 - THAYER; JOHN G. ;   et al. | 2006-08-24 |
Heat pipe component deployed from a compact volume Grant 7,080,681 - Wert July 25, 2 | 2006-07-25 |
Porous media cold plate Grant 7,044,199 - Thayer , et al. May 16, 2 | 2006-05-16 |
Forced fluid heat sink Grant 7,017,655 - Wilson , et al. March 28, 2 | 2006-03-28 |
Flexible loop thermosyphon Grant 7,013,955 - Phillips , et al. March 21, 2 | 2006-03-21 |
Flexible loop thermosyphon App 20060000582 - Phillips; Alfred L. ;   et al. | 2006-01-05 |
Heat pipe component deployed from a compact volume App 20050194122 - Wert, Kevin L. | 2005-09-08 |
Hybrid loop heat pipe Grant 6,926,072 - Wert August 9, 2 | 2005-08-09 |
Forced fluid heat sink App 20050133212 - Wilson, Michael J. ;   et al. | 2005-06-23 |
Hybrid loop heat pipe App 20050086806 - Wert, Kevin L. | 2005-04-28 |
Hybrid loop heat pipe App 20050087328 - Wert, Kevin L. | 2005-04-28 |
Porous media cold plate App 20050082037 - Thayer, John G. ;   et al. | 2005-04-21 |
Flexible loop thermosyphon App 20050024831 - Phillips, Alfred L. ;   et al. | 2005-02-03 |
Thermal bus for electronics systems Grant 6,804,117 - Phillips , et al. October 12, 2 | 2004-10-12 |
Thermal bus for electronics systems App 20040037045 - Phillips, Alfred L. ;   et al. | 2004-02-26 |
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