Wentworth Mold Inc.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wentworth Mold Inc..The latest application filed is for "air flow compensation for mold carrier".
- Wentworth Mold Inc. - Hamilton CA
| Patent | Date |
|---|---|
| Mold base assembly Grant 7,025,584 - Tsau April 11, 2 | 2006-04-11 |
| Air flow compensation for mold carrier Grant 6,994,542 - Tsau , et al. February 7, 2 | 2006-02-07 |
| Mold assembly with modular mold shells Grant 6,948,924 - Tsau , et al. September 27, 2 | 2005-09-27 |
| Hot fill mold shell assembly with reduced heat transfer Grant 6,913,455 - Tsau , et al. July 5, 2 | 2005-07-05 |
| Air flow compensation for mold carrier App 20050142243 - Tsau, Tar ; et al. | 2005-06-30 |
| Mold base assembly App 20050048155 - Tsau, Tar | 2005-03-03 |
| Hot fill mold shell assembly with reduced heat transfer App 20040202745 - Tsau, Tar ; et al. | 2004-10-14 |
| Mold assembly with modular mold shells App 20040202746 - Tsau, Tar ; et al. | 2004-10-14 |
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