Wenski; Guido

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wenski; Guido.The latest application filed is for "method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method".

Company Profile

0.10.12

Wenski; Guido - Burghausen DE
Wenski; Guido - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method Grant 7,541,287 - Schmolke , et al. June 2, 2	2009-06-02
Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method App 20070021042 - Schmolke; Ruediger ; et al.	2007-01-25
Epitaxially coated semiconductor wafer and process for producing it Grant 6,899,762 - Wenski , et al. May 31, 2	2005-05-31
Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers Grant 6,861,360 - Wenski , et al. March 1, 2	2005-03-01
Process for material-removing machining of both sides of semiconductor wafers Grant 6,793,837 - Wenski , et al. September 21, 2	2004-09-21
Double-side polishing process with reduced scratch rate and device for carrying out the process Grant 6,645,862 - Wenski , et al. November 11, 2	2003-11-11
Epitaxially coated semiconductor wafer and process for producing it App 20030186028 - Wenski, Guido ; et al.	2003-10-02
Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer Grant 6,583,050 - Wenski , et al. June 24, 2	2003-06-24
Silicon semiconductor wafer, and process for producing a multiplicity of semiconductor wafers App 20030109139 - Wenski, Guido ; et al.	2003-06-12
Inexpensive process for producing a multiplicity of semiconductor wafers Grant 6,566,267 - Wenski May 20, 2	2003-05-20
Process for material-removing machining of both sides of semiconductor wafers App 20030054650 - Wenski, Guido ; et al.	2003-03-20
Coated silicon wafer and process for its production App 20030041798 - Wenski, Guido ; et al.	2003-03-06
Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer App 20030045089 - Wenski, Guido ; et al.	2003-03-06
Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process Grant 6,514,424 - Wenski , et al. February 4, 2	2003-02-04
Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer Grant 6,458,688 - Wenski , et al. October 1, 2	2002-10-01
Double-side polishing process with reduced scratch rate and device for carrying out the process App 20020115387 - Wenski, Guido ; et al.	2002-08-22
Process for the surface polishing of silicon wafers App 20020077039 - Wenski, Guido ; et al.	2002-06-20
Process for polishing silicon wafers App 20020055324 - Wenski, Guido ; et al.	2002-05-09
Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process App 20010047978 - Wenski, Guido ; et al.	2001-12-06
Method for converting a reclaim wafer into a semiconductor wafer App 20010039101 - Wenski, Guido	2001-11-08
Process for producing a semiconductor wafer with polished edge App 20010014570 - Wenski, Guido ; et al.	2001-08-16
Catalyst for the catalytic afterburning of exhaust gases containing carbon monoxide and/or oxidizable organic compounds Grant 5,527,755 - Wenski , et al. June 18, 1	1996-06-18

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