Weng; Yang-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Weng; Yang-Ming.The latest application filed is for "stamping and die-cutting tool with a quick mould change design".
- Weng; Yang-Ming - Buu Yan Hsiang Chang Hua Hsien TW
- Weng; Yang-Ming - Buu Yan Hsing Chang Hua Hsien TW
- Weng, Yang-Ming - Chang Hua Hsien TW
| Patent | Date |
|---|---|
| Stamping and die-cutting tool with a quick mould change design Grant 7,219,432 - Weng May 22, 2 | 2007-05-22 |
| Stamping and die-cutting tool with a quick mould change design App 20060230811 - Weng; Yang-Ming | 2006-10-19 |
| Hole punch Grant D529,094 - Weng September 26, 2 | 2006-09-26 |
| Stamping and die-cutting tool with a quick mould change design App 20050257658 - Weng, Yang-Ming | 2005-11-24 |
| Punching device with replaceable punching die background of the invention App 20050051017 - Weng, Yang-Ming | 2005-03-10 |
| Lever-operated paper punch App 20050039590 - Weng, Yang-Ming | 2005-02-24 |
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