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Heat Shield for Chamber Door and Devices Manufactured Using Same
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Etching using chamber with top plate formed of non-oxygen containing material
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Method Of Manufacturing A Semiconductor Device And A Semiconductor Device
App 20210242309 - HSIEH; Jui Fu ; et al. | 2021-08-05 |
Heat shield for chamber door and devices manufactured using same
Grant 11,031,252 - Chuang , et al. June 8, 2 | 2021-06-08 |
Dummy Fin Etch to Form Recesses in Substrate
App 20210118816 - Kuan; Wan-Chun ; et al. | 2021-04-22 |
Integrated circuit structure having a crown-shaped semiconductor strip and an isolation region recessed in the substrate
Grant 10,861,800 - Kuan , et al. December 8, 2 | 2020-12-08 |
FinFET devices and methods of forming the same
Grant 10,825,739 - Kuan , et al. November 3, 2 | 2020-11-03 |
Heat shield for chamber door and devices manufactured using same
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Methods of forming recesses in substrates by etching dummy Fins
Grant 10,679,950 - Kuan , et al. | 2020-06-09 |
Source and Drain Structure with Reduced Contact Resistance and Enhanced Mobility
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FinFET Devices and Methods of Forming the Same
App 20200118885 - Kuan; Wan-Chun ; et al. | 2020-04-16 |
Etching Using Chamber with Top Plate Formed of Non-Oxygen Containing Material
App 20200043720 - Lin; En-Ping ; et al. | 2020-02-06 |
FinFET device and method of forming same
Grant 10,522,408 - Liao , et al. Dec | 2019-12-31 |
FinFET devices and methods of forming the same
Grant 10,510,615 - Weng , et al. Dec | 2019-12-17 |
Source and drain structure with reduced contact resistance and enhanced mobility
Grant 10,510,875 - Liao , et al. Dec | 2019-12-17 |
Etching using chamber with top plate formed of non-oxygen containing material
Grant 10,504,720 - Lin , et al. Dec | 2019-12-10 |
Semiconductor Device and Method
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Dummy Fin Etch to Form Recesses in Substrate
App 20190295960 - Kuan; Wan-Chun ; et al. | 2019-09-26 |
Integrated circuit structure having crown-shaped semiconductor strips and recesses in the substrate from etched dummy fins
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FinFET Device and Method of Forming Same
App 20190131176 - Liao; Chih-Teng ; et al. | 2019-05-02 |
Semiconductor device structure having a doped passivation layer
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Heat Shield for Chamber Door and Devices Manufactured Using Same
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Source and Drain Structure with Reduced Contact Resistance and Enhanced Mobility
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Intermetallic Doping Film with Diffusion in Source/Drain
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Intermetallic doping film with diffusion in source/drain
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System and method for selective nitride etch
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Semiconductor device, method and tool of manufacture
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Dummy Fin Etch to Form Recesses in Substrate
App 20180358306 - Kuan; Wan-Chun ; et al. | 2018-12-13 |
Semiconductor device, method, and tool of manufacture
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Heat Shield for Chamber Door and Devices Manufactured Using Same
App 20180151385 - Chuang; Meng-Je ; et al. | 2018-05-31 |
Finfet Devices And Methods Of Forming The Same
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Etching Using Chamber with Top Plate Formed of Non-Oxygen Containing Material
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FinFET Device and Method of Forming Same
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System and Method For Selective Nitride Etch
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Semiconductor Device, Method, and Tool of Manufacture
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Dummy Fin Etch to Form Recesses in Substrate
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Semiconductor Device Structure And Method For Forming The Same
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Semiconductor Device, Method and Tool of Manufacture
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Formation method of semiconductor device structure
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Sacrificial oxide with uniform thickness
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Sacrificial Oxide With Uniform Thickness
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Sacrificial oxide with uniform thickness
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Semiconductor Device And Formation Thereof
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Sacrificial Oxide With Uniform Thickness
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Feature dimension measurement
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Process For Stripping Photoresist And Removing Dielectric Liner
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Feature Dimension Measurement
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Dual damascene process
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