loadpatents
name:-0.010535955429077
name:-0.019834995269775
name:-0.0037400722503662
Weng; Ming-Kun Patent Filings

Weng; Ming-Kun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weng; Ming-Kun.The latest application filed is for "lead frame array for carrying chips and led package structure with multiple chips".

Company Profile
3.15.11
  • Weng; Ming-Kun - New Taipei TW
  • WENG; MING-KUN - NEW TAIPEI CITY TW
  • Weng; Ming-Kun - Taipei TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Lead frame array for carrying chips and LED package structure with multiple chips
Grant 11,211,313 - Lin , et al. December 28, 2
2021-12-28
LED package structure
Grant 10,655,828 - Lin , et al.
2020-05-19
Lead Frame Array For Carrying Chips And Led Package Structure With Multiple Chips
App 20200105649 - LIN; CHEN-HSIU ;   et al.
2020-04-02
Led Package Structure
App 20200041111 - LIN; CHEN-HSIU ;   et al.
2020-02-06
Wearable apparatus and photoplenthysmography sensor unit thereof
Grant 10,383,528 - Ho , et al. A
2019-08-20
Light-emitting display and method for forming the same
Grant 10,107,461 - Lin , et al. October 23, 2
2018-10-23
Manufacturing method of a flip-chip light emitting diode package module
Grant 9,978,915 - Weng , et al. May 22, 2
2018-05-22
Light-emitting Display And Method For Forming The Same
App 20170336035 - LIN; JEN-LUNG ;   et al.
2017-11-23
Wearable Apparatus And Photoplenthysmography Sensor Unit Thereof
App 20170224236 - HO; TSAN-YU ;   et al.
2017-08-10
Manufacturing Method Of A Flip-chip Light Emitting Diode Package Module
App 20170025588 - WENG; MING-KUN ;   et al.
2017-01-26
Flip-chip light emitting diode package module and manufacturing method thereof
Grant 9,490,404 - Weng , et al. November 8, 2
2016-11-08
Chip-scale packaged LED device
Grant 9,412,724 - Weng , et al. August 9, 2
2016-08-09
Chip-scale Packaged Led Device
App 20150311249 - WENG; MING-KUN ;   et al.
2015-10-29
Positioning system
Grant 9,076,856 - Wang , et al. July 7, 2
2015-07-07
Flip-chip Light Emitting Diode Package Module And Manufacturing Method Thereof
App 20150008462 - WENG; MING-KUN ;   et al.
2015-01-08
Light-emitting diode device
Grant 8,729,586 - Wu , et al. May 20, 2
2014-05-20
Positioning System
App 20130201465 - WANG; YAN-YI ;   et al.
2013-08-08
Light-emitting Diode Device
App 20130105835 - WU; CHIA-HAO ;   et al.
2013-05-02
Package carrier of light emitting diode
Grant D674,757 - Wu , et al. January 22, 2
2013-01-22
Light emitting diode
Grant D674,758 - Wu , et al. January 22, 2
2013-01-22

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed