Weng; Li-Sheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weng; Li-Sheng.The latest application filed is for "fan-out wafer-level packaging (fowlp) integrated circuits (ics) employing an electro-magnetic interference (emi) shield structure in unused fan-out area for emi shielding, and related fabrication methods".

Company Profile

7.8.12

Weng; Li-Sheng - San Diego CA
Weng; Li-Sheng - Chandler AZ
Weng; Li-Sheng - Tempe AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Repurposed seed layer for high frequency noise control and electrostatic discharge connection Grant 11,380,613 - Li , et al. July 5, 2	2022-07-05
FAN-OUT WAFER-LEVEL PACKAGING (FOWLP) INTEGRATED CIRCUITS (ICs) EMPLOYING AN ELECTRO-MAGNETIC INTERFERENCE (EMI) SHIELD STRUCTURE IN UNUSED FAN-OUT AREA FOR EMI SHIELDING, AND RELATED FABRICATION METHODS App 20220199547 - Weng; Li-Sheng ; et al.	2022-06-23
Package Comprising A Substrate And A High-density Interconnect Integrated Device App 20220149005 - SUN; Yangyang ; et al.	2022-05-12
Repurposed Seed Layer For High Frequency Noise Control And Electrostatic Discharge Connection App 20210375742 - LI; Yue ; et al.	2021-12-02
Microelectronic package having electromagnetic interference shielding Grant 11,189,574 - Weng , et al. November 30, 2	2021-11-30
Package comprising a substrate having a via wall configured as a shield Grant 11,139,224 - Zhang , et al. October 5, 2	2021-10-05
Package Comprising A Substrate And A High-density Interconnect Integrated Device Coupled To The Substrate App 20210296246 - LANE; Ryan ; et al.	2021-09-23
Package Comprising A Substrate Having A Via Wall Configured As A Shield App 20210175152 - ZHANG; Chaoqi ; et al.	2021-06-10
Integrated Device Comprising Interconnect Structures Having An Inner Interconnect, A Dielectric Layer And A Conductive Layer App 20210125951 - WENG; Li-Sheng ; et al.	2021-04-29
Microelectronic Package Having Electromagnetic Interference Shielding App 20210118809 - Weng; Li-Sheng ; et al.	2021-04-22
Conductive coating for a microelectronics package Grant 10,910,314 - Weng , et al. February 2, 2	2021-02-02
Solder resist layer structures for terminating de-featured components and methods of making the same Grant 10,658,198 - Weng , et al.	2020-05-19
Conductive Coating For A Microelectronics Package App 20200118930 - Weng; Li-Sheng ; et al.	2020-04-16
Conductive coating for a microelectronics package Grant 10,510,667 - Weng , et al. Dec	2019-12-17
Solder Resist Layer Structures For Terminating De-featured Components And Methods Of Making The Same App 20190181017 - Weng; Li-Sheng ; et al.	2019-06-13
Solder resist layer structures for terminating de-featured components and methods of making the same Grant 10,244,632 - Weng , et al.	2019-03-26
Solder Resist Layer Structures For Terminating De-featured Components And Methods Of Making The Same App 20180255640 - Weng; Li-Sheng ; et al.	2018-09-06
Conductive Coating For A Microelectronics Package App 20180174972 - Weng; Li-Sheng ; et al.	2018-06-21
Integrated circuit package including floating package stiffener Grant 9,900,976 - Chen , et al. February 20, 2	2018-02-20
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks App 20160268213 - JIANG; Hongjin ; et al.	2016-09-15

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