Weng; Chou-Chin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Weng; Chou-Chin.The latest application filed is for "substrate packaging structure and packaging method thereof".
- Weng; Chou-Chin - Hsin-Chu TW
- Weng; Chou-Chin - Hsinchu N/A TW
- Weng; Chou-Chin - Hsinchu City TW
| Patent | Date |
|---|---|
| Substrate packaging structure and packaging method thereof Grant 10,058,955 - Hsiao , et al. August 28, 2 | 2018-08-28 |
| Substrate Packaging Structure And Packaging Method Thereof App 20150202715 - HSIAO; Chih-Hung ; et al. | 2015-07-23 |
| Fabricating method of light emitting device and forming method of organic layer Grant 8,703,529 - Chen , et al. April 22, 2 | 2014-04-22 |
| Fabricating Method Of Light Emitting Device And Forming Method Of Organic Layer App 20130130422 - Chen; Eng-Jay ; et al. | 2013-05-23 |
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