loadpatents
name:-0.0059769153594971
name:-0.00088906288146973
name:-0.00048494338989258
Wendler; Roger E. JR. Patent Filings

Wendler; Roger E. JR.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wendler; Roger E. JR..The latest application filed is for "soft paper product including beneficial agents".

Company Profile
0.0.6
  • Wendler; Roger E. JR. - Sherwood WI
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Soft paper product including beneficial agents
App 20060016570 - Liu; Kou-Chang ;   et al.
2006-01-26
Heated embossing and ply attachment
App 20050241788 - Baggot, James L. ;   et al.
2005-11-03
Soft paper product including beneficial agents
App 20040099392 - Liu, Kou-Chang ;   et al.
2004-05-27
Heated embossing and ply attachment
App 20030111169 - Baggot, James L. ;   et al.
2003-06-19
Multi-layer sheet material web assembly
App 20010019756 - Wendler, Roger E. JR.
2001-09-06
Apparatus for embossing and crimping a multi-layer sheet material web assembly
App 20010019757 - Wendler,, Roger E. JR.
2001-09-06

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