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name:-0.19709491729736
name:-0.0078058242797852
name:-0.0052709579467773
WEN; An-Nong Patent Filings

WEN; An-Nong

Patent Applications and Registrations

Patent applications and USPTO patent grants for WEN; An-Nong.The latest application filed is for "semiconductor package and method for manufacturing the same".

Company Profile
2.4.8
  • WEN; An-Nong - Kaohsiung TW
  • Wen; An-Nong - Hsinchu TW
  • Wen; An-Nong - Taoyuan TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Package And Method For Manufacturing The Same
App 20220068868 - WEN; An-Nong ;   et al.
2022-03-03
Semiconductor package and method for manufacturing the same
Grant 11,171,108 - Wen , et al. November 9, 2
2021-11-09
Semiconductor package including cap layer and dam structure and method of manufacturing the same
Grant 11,133,278 - Huang , et al. September 28, 2
2021-09-28
Semiconductor Package And Method Of Manufacturing The Same
App 20200111760 - HUANG; Yu-Che ;   et al.
2020-04-09
Semiconductor Package And Method For Manufacturing The Same
App 20200111761 - WEN; An-Nong ;   et al.
2020-04-09
Package base structure and associated manufacturing method
Grant 8,048,694 - Wen , et al. November 1, 2
2011-11-01
Package Base Structure And Manufacturing Method Thereof
App 20110049554 - Wu; Mao-Jen ;   et al.
2011-03-03
Optical Pickup Head
App 20100220575 - Sun; Wen-Hsin ;   et al.
2010-09-02
Side-view optical diode package and fabricating process thereof
Grant 7,701,050 - Chen , et al. April 20, 2
2010-04-20
Side-view Optical Diode Package And Fabricating Process Thereof
App 20080142832 - Chen; Chih-Ming ;   et al.
2008-06-19
Package-base Structure Of Power Semiconductor Device And Manufacturing Process Of The Same
App 20080036045 - Chen; Chih-Ming ;   et al.
2008-02-14
Package Base Structure And Associated Manufacturing Method
App 20070246724 - Wen; An-Nong ;   et al.
2007-10-25

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