Patent | Date |
---|
Module having a stacked passive element and method of forming the same Grant 9,054,086 - Lotfi , et al. June 9, 2 | 2015-06-09 |
Module having a stacked magnetic device and semiconductor device and method of forming the same Grant 8,339,802 - Lotfi , et al. December 25, 2 | 2012-12-25 |
Module having a stacked magnetic device and semiconductor device and method of forming the same Grant 8,266,793 - Lotfi , et al. September 18, 2 | 2012-09-18 |
Module having a stacked passive element and method of forming the same Grant 8,153,473 - Lotfi , et al. April 10, 2 | 2012-04-10 |
Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same App 20100214746 - Lotfi; Ashraf W. ;   et al. | 2010-08-26 |
Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same App 20100212150 - Lotfi; Ashraf W. ;   et al. | 2010-08-26 |
Module Having A Stacked Passive Element And Method Of Forming The Same App 20100087036 - Lotfi; Ashraf W. ;   et al. | 2010-04-08 |
Module Having A Stacked Passive Element And Method Of Forming The Same App 20100084750 - Lotfi; Ashraf W. ;   et al. | 2010-04-08 |
Precision two dimensional optical fiber array Grant 6,827,500 - Basavanhally , et al. December 7, 2 | 2004-12-07 |
Fiber array coupler Grant 6,633,719 - Basavanhally , et al. October 14, 2 | 2003-10-14 |
Optical system having improved fiber-device coupling Grant 6,588,942 - Weld , et al. July 8, 2 | 2003-07-08 |
Precision two dimensional optical fiber array App 20030002818 - Basavanhally, Nagesh R. ;   et al. | 2003-01-02 |
Fiber array coupler App 20020197047 - Basavanhally, Nagesh Ramamoorthy ;   et al. | 2002-12-26 |
Faceplate for network switching apparatus Grant 6,281,433 - Decker , et al. August 28, 2 | 2001-08-28 |
Temperature compensating device for fiber gratings Grant 6,147,341 - Lemaire , et al. November 14, 2 | 2000-11-14 |
Encapsulated package for power magnetic devices and method of manufacture therefor Grant 5,787,569 - Lotfi , et al. August 4, 1 | 1998-08-04 |
Molded encapsulated electronic component Grant 5,773,322 - Weld June 30, 1 | 1998-06-30 |
Weatherable outside electronic device enclosure Grant 5,754,643 - Decker , et al. May 19, 1 | 1998-05-19 |
Microelectronic package with device cooling Grant 5,696,405 - Weld December 9, 1 | 1997-12-09 |
Encapsulated, integrated power magnetic device and method of manufacture therefor Grant 5,659,462 - Chen , et al. August 19, 1 | 1997-08-19 |
High frequency surface mount transformer-diode power module Grant 5,642,276 - Lotfi , et al. June 24, 1 | 1997-06-24 |