Weisman; Renee L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weisman; Renee L..The latest application filed is for "additives for grain fragmentation in pb-free sn-based solder".

Company Profile

0.12.11

Weisman; Renee L. - Poughkeepsie NY
Weisman; Renee L - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,910,853 - Arvin , et al. December 16, 2	2014-12-16
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20130284495 - Arvin; Charles L. ; et al.	2013-10-31
Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,493,746 - Arvin , et al. July 23, 2	2013-07-23
Optimization of metallurgical properties of a solder joint Grant 8,197,612 - Busby , et al. June 12, 2	2012-06-12
Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers Grant 8,156,990 - Bunt , et al. April 17, 2	2012-04-17
Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers Grant 7,947,143 - Bunt , et al. May 24, 2	2011-05-24
Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers Grant 7,836,935 - Bunt , et al. November 23, 2	2010-11-23
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20100200271 - Arvin; Charles L. ; et al.	2010-08-12
Optimization Of Metallurgical Properties Of A Solder Joint App 20090266447 - BUSBY; JAMES A. ; et al.	2009-10-29
Apparatus For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers App 20080190565 - Bunt; Jay A. ; et al.	2008-08-14
Method For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers App 20080190545 - Bunt; Jay A. ; et al.	2008-08-14
Apparatus For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers App 20080190566 - Bunt; Jay A. ; et al.	2008-08-14
Fast firing flattening apparatus for sintered multilayer ceramic electronic substrates Grant 7,258,537 - Bezama , et al. August 21, 2	2007-08-21
Method And Apparatus For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers App 20070113950 - Bunt; Jay A. ; et al.	2007-05-24
Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates Grant 6,900,073 - Bezama , et al. May 31, 2	2005-05-31
Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates App 20050054200 - Bezama, Raschid J. ; et al.	2005-03-10
Fast Firing Flattening Method And Apparatus For Sintered Multilayer Ceramic Electronic Substrates App 20040203184 - Bezama, Raschid J. ; et al.	2004-10-14
EMI shielding for semiconductor chip carriers Grant 6,740,959 - Alcoe , et al. May 25, 2	2004-05-25
EMI shielding for semiconductor chip carriers App 20030025180 - Alcoe, David James ; et al.	2003-02-06
Multi-level web structure in use for thin sheet processing App 20020092600 - Natarajan, Govindarajan ; et al.	2002-07-18
Single mask screening process Grant 6,238,741 - Blazick , et al. May 29, 2	2001-05-29
Re-work method for removing extraneous metal from cermic substrates Grant 4,504,322 - Adwalpalker , et al. March 12, 1	1985-03-12

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