Weiser; Martin W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weiser; Martin W..The latest application filed is for "method of refining solder materials".

Company Profile

0.3.14

Weiser; Martin W. - Liberty Lake WA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of refining solder materials Grant 9,666,547 - Weiser , et al. May 30, 2	2017-05-30
Method Of Refining Solder Materials App 20100206133 - Weiser; Martin W. ; et al.	2010-08-19
Methods of refining lead-containing materials Grant 7,521,286 - Weiser , et al. April 21, 2	2009-04-21
Thermal Interconnect And Interface Materials, Methods Of Production And Uses Thereof App 20080291634 - Weiser; Martin W. ; et al.	2008-11-27
Modified Solder Alloys For Electrical Interconnects, Methods Of Production And Uses Thereof App 20080118761 - Weiser; Martin W. ; et al.	2008-05-22
Thermal interconnect and interface materials, methods of production and uses thereof App 20080023665 - Weiser; Martin W. ; et al.	2008-01-31
Synergistically-modified surfaces and surface profiles for use with thermal interconnect and interface materials, methods of production and uses thereof App 20080026181 - Rastogi; Ravi ; et al.	2008-01-31
Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof App 20070138442 - Weiser; Martin W.	2007-06-21
Lead-containing solder bumps App 20070045842 - Weiser; Martin W. ; et al.	2007-03-01
Lead-containing anodes App 20070045838 - Weiser; Martin W. ; et al.	2007-03-01
Lead-containing solder paste App 20070045839 - Weiser; Martin W. ; et al.	2007-03-01
Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages App 20070013054 - Ruchert; Brian D. ; et al.	2007-01-18
Methods of refining lead-containing materials App 20060201279 - Weiser; Martin W. ; et al.	2006-09-14
Thermal interface materials; and compositions comprising indium and zinc App 20050040369 - Lalena, John N. ; et al.	2005-02-24
Anodes for electroplating operations, and methods of forming materials over semiconductor substrates App 20050000821 - White, Tamara L ; et al.	2005-01-06
Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials App 20040065954 - Weiser, Martin W. ; et al.	2004-04-08

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