Wein; Stefan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wein; Stefan.The latest application filed is for "method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds".

Company Profile

0.7.11

Wein; Stefan - Regensburg DE
Wein; Stefan - Lappersdorf DE
Wein; Stefan - Rogensburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds Grant 7,517,722 - Goller , et al. April 14, 2	2009-04-14
Electronic component with a plastic package and method for production Grant 7,276,783 - Goller , et al. October 2, 2	2007-10-02
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds App 20060258046 - Goller; Bernd ; et al.	2006-11-16
Electronic component with at least one semiconductor chip and method for its manufacture Grant 6,953,992 - Goller , et al. October 11, 2	2005-10-11
Electronic device configured as a multichip module, leadframe and panel with leadframe positions App 20050184375 - Goller, Bernd ; et al.	2005-08-25
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device Grant 6,902,951 - Goller , et al. June 7, 2	2005-06-07
Universal package for an electronic component with a semiconductor chip and method for producing the universal package Grant 6,867,471 - Goller , et al. March 15, 2	2005-03-15
Electronic component with a plastic housing and method for production thereof App 20040232543 - Goller, Bernd ; et al.	2004-11-25
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device App 20040140559 - Goller, Bernd ; et al.	2004-07-22
Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component Grant 6,710,455 - Goller , et al. March 23, 2	2004-03-23
Universal package for an electronic component with a semiconductor chip and method for producing the universal package App 20040041251 - Goller, Bernd ; et al.	2004-03-04
Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housing App 20040043515 - Goller, Bernd ; et al.	2004-03-04
Electronic component and process for producing the electronic component Grant 6,683,374 - Goller , et al. January 27, 2	2004-01-27
Electronic component with at least one semiconductor chip and method for its manufacture App 20030071336 - Goller, Bernd ; et al.	2003-04-17
Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component App 20030047813 - Goller, Bernd ; et al.	2003-03-13
Electronic component with at least two stacked semiconductor chips, and fabrication method App 20030042591 - Goller, Bernd ; et al.	2003-03-06
Electronic component and process for producing the electronic component App 20030042590 - Goller, Bernd ; et al.	2003-03-06
Electronic component with at least two stacked semiconductor chips and process for producing the electronic component App 20030043555 - Goller, Bernd ; et al.	2003-03-06

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