Weimer; Ronald A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weimer; Ronald A..The latest application filed is for "thickened sidewall dielectric for memory cell".

Company Profile

2.92.90

Weimer; Ronald A. - Boise ID
Weimer; Ronald A. - Laguna Hills CA
Weimer; Ronald A - Boise ID
Weimer; Ronald A. - Bosie ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thickened sidewall dielectric for memory cell Grant 11,257,838 - Weimer , et al. February 22, 2	2022-02-22
Thickened Sidewall Dielectric for Memory Cell App 20200203360 - Weimer; Ronald A. ; et al.	2020-06-25
Thickened sidewall dielectric for memory cell Grant 10,608,005 - Weimer , et al.	2020-03-31
Method and system for signal equalization in communication between computing devices Grant 9,424,226 - Weimer August 23, 2	2016-08-23
Forming air gaps in memory arrays and memory arrays with air gaps thus formed Grant 9,397,210 - Mathew , et al. July 19, 2	2016-07-19
Method and system for communication with peripheral devices Grant 9,311,268 - Chen , et al. April 12, 2	2016-04-12
Use of etch process post wordline definition to improve data retention in a flash memory device Grant 9,082,714 - Koval , et al. July 14, 2	2015-07-14
Forming Air Gaps In Memory Arrays And Memory Arrays With Air Gaps Thus Formed App 20140027832 - Mathew; James ; et al.	2014-01-30
Forming air gaps in memory arrays and memory arrays with air gaps thus formed Grant 8,569,130 - Mathew , et al. October 29, 2	2013-10-29
Use Of Etch Process Post Wordline Definition To Improve Data Retention In A Flash Memory Device App 20130264628 - Koval; Randy J. ; et al.	2013-10-10
Methods and systems for controlling temperature during microfeature workpiece processing, E.G., CVD deposition Grant 8,518,184 - Beaman , et al. August 27, 2	2013-08-27
Methods For Forming Small-scale Capacitor Structures App 20130166057 - Zheng; Lingyi A. ; et al.	2013-06-27
Methods for forming small-scale capacitor structures Grant 8,384,192 - Zheng , et al. February 26, 2	2013-02-26
Forming Air Gaps In Memory Arrays And Memory Arrays With Air Gaps Thus Formed App 20130026600 - Matthew; James ; et al.	2013-01-31
Use of dilute steam ambient for improvement of flash devices Grant 8,294,192 - Weimer , et al. October 23, 2	2012-10-23
Memory cells containing charge-trapping zones Grant 8,228,743 - Min , et al. July 24, 2	2012-07-24
Methods of forming memory cells Grant 8,119,483 - Weimer February 21, 2	2012-02-21
Use Of Dilute Steam Ambient For Improvement Of Flash Devices App 20110254075 - Weimer; Ronald A. ; et al.	2011-10-20
Use of dilute steam ambient for improvement of flash devices Grant 7,989,870 - Weimer , et al. August 2, 2	2011-08-02
Methods For Forming Small-scale Capacitor Structures App 20110163416 - Zheng; Lingyi A. ; et al.	2011-07-07
Methods Of Forming Memory Cells App 20110147826 - Weimer; Ronald A.	2011-06-23
Memory Cells App 20110133268 - Min; Kyu S. ; et al.	2011-06-09
Methods of forming non-volatile memory cells, and methods of forming NAND cell unit string gates Grant 7,915,126 - Weimer March 29, 2	2011-03-29
Methods for forming small-scale capacitor structures Grant 7,906,393 - Zheng , et al. March 15, 2	2011-03-15
Memory cells, electronic systems, methods of forming memory cells, and methods of programming memory cells Grant 7,898,850 - Min , et al. March 1, 2	2011-03-01
Methods And Systems For Controlling Temperature During Microfeature Workpiece Processing, E.g., Cvd Deposition App 20100282164 - Beaman; Kevin L. ; et al.	2010-11-11
Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD deposition Grant 7,771,537 - Beaman , et al. August 10, 2	2010-08-10
Use Of Dilute Steam Ambient For Improvement Of Flash Devices App 20100032746 - Weimer; Ronald A. ; et al.	2010-02-11
Methods of forming programmable memory devices Grant 7,651,910 - Beaman , et al. January 26, 2	2010-01-26
Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers Grant 7,647,886 - Kubista , et al. January 19, 2	2010-01-19
Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers Grant 7,584,942 - Gealy , et al. September 8, 2	2009-09-08
Use of dilute steam ambient for improvement of flash devices Grant 7,585,725 - Weimer , et al. September 8, 2	2009-09-08
Method of composite gate formation Grant 7,576,398 - Weimer August 18, 2	2009-08-18
Memory Cells, Electronic Systems, Methods Of Forming Memory Cells, And Methods of Programming Memory Cells App 20090097320 - Min; Kyu S. ; et al.	2009-04-16
Capacitor structures with oxynitride layer between capacitor plate and capacitor dielectric layer Grant 7,489,000 - Weimer February 10, 2	2009-02-10
Use Of Dilute Steam Ambient For Improvement Of Flash Devices App 20090004794 - Weimer; Ronald A. ; et al.	2009-01-01
Method of improved high K dielectric-polysilicon interface for CMOS devices Grant 7,470,583 - Weimer December 30, 2	2008-12-30
Deposition Apparatuses App 20080245301 - Weimer; Ronald A.	2008-10-09
Apparatus having a memory device with floating gate layer grain boundaries with oxidized portions Grant 7,432,546 - Weimer , et al. October 7, 2	2008-10-07
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces Grant 7,422,635 - Zheng , et al. September 9, 2	2008-09-09
Methods of enabling polysilicon gate electrodes for high-k gate dielectrics Grant 7,416,933 - Weimer August 26, 2	2008-08-26
Methods of forming non-volatile memory cells, and methods of forming NAND cell unit string gates App 20080194066 - Weimer; Ronald A.	2008-08-14
Deposition methods Grant 7,407,892 - Weimer August 5, 2	2008-08-05
Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers Grant 7,344,755 - Beaman , et al. March 18, 2	2008-03-18
Double sided container process used during the manufacture of a semiconductor device Grant 7,345,333 - DeBoer , et al. March 18, 2	2008-03-18
Method of composite gate formation Grant 7,323,756 - Weimer January 29, 2	2008-01-29
Method of composite gate formation Grant 7,323,755 - Weimer January 29, 2	2008-01-29
Anti-reflective coating doped with carbon for use in integrated circuit technology and method of formation Grant 7,282,439 - Weimer , et al. October 16, 2	2007-10-16
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces Grant 7,279,398 - Basceri , et al. October 9, 2	2007-10-09
Single substrate annealing of magnetoresistive structure Grant 7,264,768 - Tuttle , et al. September 4, 2	2007-09-04
Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition Grant 7,258,892 - Beaman , et al. August 21, 2	2007-08-21
Methods of forming transistor devices and capacitor constructions Grant 7,253,053 - Eppich , et al. August 7, 2	2007-08-07
Method of composite gate formation Grant 7,247,920 - Weimer July 24, 2	2007-07-24
System and device including a barrier layer Grant 7,245,010 - Powell , et al. July 17, 2	2007-07-17
Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces Grant 7,235,138 - Zheng , et al. June 26, 2	2007-06-26
Method of improved high K dielectric--polysilicon interface for CMOS devices Grant 7,227,209 - Weimer June 5, 2	2007-06-05
Method of fabricating a semiconductor device with a wet oxidation with steam process Grant 7,176,079 - Weimer , et al. February 13, 2	2007-02-13
Method of manufacturing devices comprising conductive nano-dots, and devices comprising same Grant 7,173,304 - Weimer , et al. February 6, 2	2007-02-06
Method of composite gate formation App 20060289951 - Weimer; Ronald A.	2006-12-28
Method of composite gate formation App 20060289949 - Weimer; Ronald A.	2006-12-28
Method of composite gate formation App 20060289950 - Weimer; Ronald A.	2006-12-28
Method of composite gate formation App 20060289952 - Weimer; Ronald A.	2006-12-28
Method Of Manufacturing Devices Comprising Conductive Nano-dots, And Devices Comprising Same App 20060273376 - Weimer; Ronald A. ; et al.	2006-12-07
Double sided container process used during the manufacture of a semiconductor device App 20060267062 - DeBoer; Scott J. ; et al.	2006-11-30
Deposition methods, and deposition apparatuses App 20060258157 - Weimer; Ronald A.	2006-11-16
Methods of forming programmable memory devices App 20060252207 - Beaman; Kevin L. ; et al.	2006-11-09
Method of improved high K dielectric-polysilicon interface for CMOS devices Grant 7,129,128 - Weimer October 31, 2	2006-10-31
Capacitor constructions Grant 7,126,181 - Eppich , et al. October 24, 2	2006-10-24
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces App 20060213440 - Zheng; Lingyi A. ; et al.	2006-09-28
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces App 20060205187 - Zheng; Lingyi A. ; et al.	2006-09-14
Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD deposition App 20060204649 - Beaman; Kevin L. ; et al.	2006-09-14
Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers App 20060196538 - Kubista; David J. ; et al.	2006-09-07
Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces App 20060198955 - Zheng; Lingyi A. ; et al.	2006-09-07
Plasma nitridization for adjusting transistor threshold voltage App 20060194446 - Beaman; Kevin L. ; et al.	2006-08-31
Plasma nitridization for adjusting transistor threshold voltage App 20060194452 - Beaman; Kevin L. ; et al.	2006-08-31
System and device including a barrier layer Grant 7,095,088 - Powell , et al. August 22, 2	2006-08-22
System and device including a barrier layer App 20060175673 - Powell; Don Carl ; et al.	2006-08-10
Process of forming an electrically erasable programmable read only memory with an oxide layer exposed to hydrogen and nitrogen Grant 7,087,182 - Weimer August 8, 2	2006-08-08
Double sided container process used during the manufacture of a semiconductor device Grant 7,084,448 - DeBoer , et al. August 1, 2	2006-08-01
CMOS constructions Grant 7,081,656 - Eppich , et al. July 25, 2	2006-07-25
Method of improved high K dielectric - polysilicon interface for CMOS devices App 20060141698 - Weimer; Ronald A.	2006-06-29
Method of improved high K dielectric - polysilicon interface for CMOS devices App 20060138594 - Weimer; Ronald A.	2006-06-29
Method of processing a transistor gate dielectric film with stem Grant 7,064,052 - Weimer , et al. June 20, 2	2006-06-20
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces App 20060121689 - Basceri; Cem ; et al.	2006-06-08
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces Grant 7,056,806 - Basceri , et al. June 6, 2	2006-06-06
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces App 20060115957 - Basceri; Cem ; et al.	2006-06-01
Method of fabricating a semiconductor device with a dielectric film using a wet oxidation with steam process Grant 7,022,623 - Weimer , et al. April 4, 2	2006-04-04
Transistor devices, and methods of forming transistor devices and circuit devices Grant 7,019,351 - Eppich , et al. March 28, 2	2006-03-28
Nucleation for improved flash erase characteristics Grant 6,998,675 - Weimer February 14, 2	2006-02-14
Methods of enabling polysilicon gate electrodes for high-k gate dieletrics App 20060030096 - Weimer; Ronald A.	2006-02-09
Use of dilute steam ambient for improvement of flash devices App 20060011969 - Weimer; Ronald A. ; et al.	2006-01-19
Anti-reflective coating doped with carbon for use in integrated circuit technology and method of formation App 20060009028 - Weimer; Ronald A. ; et al.	2006-01-12
System and device including a barrier alayer App 20050275044 - Powell, Don Carl ; et al.	2005-12-15
Use of atomic oxygen process for improved barrier layer Grant 6,972,223 - Weimer , et al. December 6, 2	2005-12-06
Films doped with carbon for use in integrated circuit technology Grant 6,963,101 - Weimer , et al. November 8, 2	2005-11-08
Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers App 20050217575 - Gealy, Dan ; et al.	2005-10-06
Use of dilute steam ambient for improvement of flash devices Grant 6,949,789 - Weimer , et al. September 27, 2	2005-09-27
Method of fabricating a capacitive element for a semiconductor device Grant 6,949,477 - Weimer , et al. September 27, 2	2005-09-27
Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source Grant 6,924,197 - Weimer August 2, 2	2005-08-02
Methods for forming small-scale capacitor structures App 20050164466 - Zheng, Lingyi A. ; et al.	2005-07-28
Integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source Grant 6,921,937 - Weimer July 26, 2	2005-07-26
Single substrate annealing of magnetoresistive structure Grant 6,918,965 - Tuttle , et al. July 19, 2	2005-07-19
Single substrate annealing of magnetoresistive structure App 20050133118 - Tuttle, Mark E. ; et al.	2005-06-23
Gas passivation on nitride encapsulated devices Grant 6,908,868 - Weimer , et al. June 21, 2	2005-06-21
Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition App 20050126489 - Beaman, Kevin L. ; et al.	2005-06-16
Capacitor constructions App 20050101078 - Eppich, Denise M. ; et al.	2005-05-12
Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers App 20050081786 - Kubista, David J. ; et al.	2005-04-21
Methods of forming deuterated silicon nitride-containing materials Grant 6,881,636 - Weimer , et al. April 19, 2	2005-04-19
Ammonia gas passivation on nitride encapsulated devices Grant 6,882,031 - Weimer , et al. April 19, 2	2005-04-19
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces App 20050059261 - Basceri, Cem ; et al.	2005-03-17
Fabrication of DRAM and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process App 20050048793 - Weimer, Ronald A. ; et al.	2005-03-03
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces App 20050045102 - Zheng, Lingyi A. ; et al.	2005-03-03
Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers App 20050039680 - Beaman, Kevin L. ; et al.	2005-02-24
Method of composite gate formation App 20050032393 - Weimer, Ronald A.	2005-02-10
Method of composite gate formation App 20050026348 - Weimer, Ronald A.	2005-02-03
Forming a conductive structure in a semiconductor device Grant 6,849,544 - Weimer , et al. February 1, 2	2005-02-01
Methods of forming deuterated silicon nitride-containing materials App 20050003680 - Weimer, Ronald A. ; et al.	2005-01-06
Nucleation for improved flash erase characteristics App 20040229433 - Weimer, Ronald A.	2004-11-18
Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source Grant 6,815,805 - Weimer November 9, 2	2004-11-09
System and device including a barrier layer App 20040217476 - Powell, Don Carl ; et al.	2004-11-04
Plasma nitridization for adjusting transistor threshold voltage App 20040183144 - Beaman, Kevin L. ; et al.	2004-09-23
Methods of forming transistor devices and capacitor constructions App 20040178432 - Eppich, Denise M. ; et al.	2004-09-16
CMOS constructions and capacitor constructions App 20040178458 - Eppich, Denise M. ; et al.	2004-09-16
Transistor devices, CMOS constructions, capacitor constructions, and methods of forming transistor devices and capacitor constructions App 20040180487 - Eppich, Denise M. ; et al.	2004-09-16
Use of atomic oxygen process for improved barrier layer Grant 6,791,138 - Weimer , et al. September 14, 2	2004-09-14
Methods of selective oxidation conditions for dielectric conditioning Grant 6,784,124 - Weimer , et al. August 31, 2	2004-08-31
Double sided container process used during the manufacture of a semiconductor device App 20040164335 - DeBoer, Scott J. ; et al.	2004-08-26
Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source App 20040164344 - Weimer, Ronald A.	2004-08-26
Films doped with carbon for use in integrated circuit technology App 20040164336 - Weimer, Ronald A. ; et al.	2004-08-26
System and device including a barrier layer Grant 6,774,443 - Powell , et al. August 10, 2	2004-08-10
Nucleation for improved flash erase characteristics Grant 6,762,451 - Weimer July 13, 2	2004-07-13
Use of selective oxidation conditions for dielectric conditioning Grant 6,734,531 - Weimer , et al. May 11, 2	2004-05-11
Films doped with carbon for use in integrated circuit technology Grant 6,713,807 - Weimer , et al. March 30, 2	2004-03-30
Single substrate annealing of magnetoresistive structure App 20040040628 - Tuttle, Mark E. ; et al.	2004-03-04
Double sided container process used during the manufacture of a semiconductor device Grant 6,696,336 - DeBoer , et al. February 24, 2	2004-02-24
Methods of forming programmable memory devices App 20030216000 - Beaman, Kevin L. ; et al.	2003-11-20
Forming a conductive structure in a semiconductor device App 20030207556 - Weimer, Ronald A. ; et al.	2003-11-06
Use Of Selective Oxidation Conditions For Dielectric Conditioning App 20030160305 - Weimer, Ronald A. ; et al.	2003-08-28
Ammonia gas passivation on nitride encapsulated devices App 20030157815 - Weimer, Ronald A. ; et al.	2003-08-21
Process of forming an electrically erasable programmable read only memory with an oxide layer exposed to hydrogen and nitrogen App 20030157807 - Weimer, Ronald A.	2003-08-21
Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source App 20030157769 - Weimer, Ronald A.	2003-08-21
Methods of selective oxidation conditions for dielectric conditioning App 20030153144 - Weimer, Ronald A. ; et al.	2003-08-14
Integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source App 20030141536 - Weimer, Ronald A.	2003-07-31
Forming a conductive structure in a semiconductor device Grant 6,596,595 - Weimer , et al. July 22, 2	2003-07-22
Method for processing wafers in a semiconductor fabrication system Grant 6,592,661 - Thakur , et al. July 15, 2	2003-07-15
Use of selective oxidation conditions for dielectric conditioning Grant 6,576,979 - Weimer , et al. June 10, 2	2003-06-10
Method for forming flash memory device having a tunnel dielectric comprising nitrided oxide Grant 6,559,007 - Weimer May 6, 2	2003-05-06
Use of atomic oxygen process for improved barrier layer App 20030054623 - Weimer, Ronald A. ; et al.	2003-03-20
Method of composite gate formation App 20030052377 - Weimer, Ronald A.	2003-03-20
Method of improved high K dielectric - polysilicon interface for CMOS devices App 20030052358 - Weimer, Ronald A.	2003-03-20
Method of improved high K dielectric-polysilicon interface for CMOS devices App 20030042526 - Weimer, Ronald A.	2003-03-06
Method of composite gate formation App 20030040171 - Weimer, Ronald A.	2003-02-27
Films doped with carbon for use in integrated circuit technology App 20030020108 - Weimer, Ronald A. ; et al.	2003-01-30
Nucleation for improved flash erase characteristics App 20020192909 - Weimer, Ronald A.	2002-12-19
Fabrication of dram and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process App 20020151107 - Weimer, Ronald A. ; et al.	2002-10-17
Films doped with carbon for use in integrated circuit technology Grant 6,462,371 - Weimer , et al. October 8, 2	2002-10-08
Nucleation for improved flash erase characteristics Grant 6,455,372 - Weimer September 24, 2	2002-09-24
Use of atomic oxygen process for improved barrier layer App 20020132397 - Weimer, Ronald A. ; et al.	2002-09-19
Use of dilute steam ambient for improvement of flash devices App 20020117709 - Weimer, Ronald A. ; et al.	2002-08-29
Use of selective oxidation conditions for dielectric conditioning App 20020096745 - Weimer, Ronald A. ; et al.	2002-07-25
Use of atomic oxidation for fabrication of oxide-nitride-oxide stack for flash memory devices App 20020090783 - Beaman, Kevin L. ; et al.	2002-07-11
Ammonia gas passivation on nitride encapsulated devices App 20020074622 - Weimer, Ronald A. ; et al.	2002-06-20
System and device including a barrier layer App 20020060348 - Powell, Don Carl ; et al.	2002-05-23
Fabrication of DRAM and other semiconductor devices with an insulating film using a wet rapid thermal oxidation process App 20020045358 - Weimer, Ronald A. ; et al.	2002-04-18
Forming a conductive structure in a semiconductor device Grant 6,362,086 - Weimer , et al. March 26, 2	2002-03-26
Method for forming a barrier layer App 20020025658 - Powell, Don Carl ; et al.	2002-02-28
Use of dilute steam ambient for improvement of flash devices Grant 6,348,380 - Weimer , et al. February 19, 2	2002-02-19
Fabrication Of Dram And Other Semiconductor Devices With An Insulating Film Using A Wet Rapid Thermal Oxidation Process App 20010051406 - WEIMER, RONALD A. ; et al.	2001-12-13
Forming a conductive structure in a semiconductor device Grant 6,291,868 - Weimer , et al. September 18, 2	2001-09-18
Forming A Conductive Structure In A Semiconductor Device App 20010014522 - WEIMER, RONALD A. ; et al.	2001-08-16
Method of monitoring emissivity Grant 6,177,127 - Weimer , et al. January 23, 2	2001-01-23
DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films Grant 6,150,208 - Deboer , et al. November 21, 2	2000-11-21
Method of forming polysilicon having a desired surface roughness Grant 5,962,065 - Weimer , et al. October 5, 1	1999-10-05
Method of forming hemispherical grained silicon Grant 5,759,262 - Weimer , et al. June 2, 1	1998-06-02
Method for forming hemispherical grained silicon Grant 5,634,974 - Weimer , et al. June 3, 1	1997-06-03
Apparatus and method for achieving growth-etch deposition of diamond using a chopped oxygen-acetylene flame Grant 5,505,158 - Thorpe, Jr. , et al. April 9, 1	1996-04-09