| Patent | Date |
|---|
Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
Grant 11,424,201 - Rogalli , et al. August 23, 2 | 2022-08-23 |
Semiconductor Device Including A Solder Compound Containing A Compound Sn/sb
App 20220216173 - Behrens; Thomas ; et al. | 2022-07-07 |
Semiconductor device power metallization layer with stress-relieving heat sink structure
Grant 11,276,624 - Nelhiebel , et al. March 15, 2 | 2022-03-15 |
Semiconductor chip and method of processing a semiconductor chip
Grant 11,164,830 - Bonart , et al. November 2, 2 | 2021-11-02 |
Barrier for power metallization in semiconductor devices
Grant 11,127,693 - Gatterbauer , et al. September 21, 2 | 2021-09-21 |
Semiconductor device including a solder compound containing a compound Sn/Sb
Grant 11,069,644 - Behrens , et al. July 20, 2 | 2021-07-20 |
Semiconductor Device Power Metallization Layer with Stress-Relieving Heat Sink Structure
App 20210183732 - Nelhiebel; Michael ; et al. | 2021-06-17 |
Semiconductor device with compressive interlayer
Grant 10,700,019 - Mataln , et al. | 2020-06-30 |
Electrolyte, method of forming a copper layer and method of forming a chip
Grant 10,648,096 - Robl , et al. | 2020-05-12 |
Semiconductor device with metal structure electrically connected to a conductive structure
Grant 10,651,140 - Schneegans , et al. | 2020-05-12 |
Barrier for Power Metallization in Semiconductor Devices
App 20200111754 - Gatterbauer; Johann ; et al. | 2020-04-09 |
Semiconductor Device Including A Solder Compound Containing A Compound Sn/sb
App 20200105704 - Behrens; Thomas ; et al. | 2020-04-02 |
Semiconductor devices for integration with light emitting chips and modules thereof
Grant 10,607,972 - Bonart , et al. | 2020-03-31 |
Semiconductor Device with Compressive Interlayer
App 20190273050 - Mataln; Marianne ; et al. | 2019-09-05 |
Compressive interlayer having a defined crack-stop edge extension
Grant 10,304,782 - Mataln , et al. | 2019-05-28 |
Compressive Interlayer Having a Defined Crack-Stop Edge Extension
App 20190067209 - Mataln; Marianne ; et al. | 2019-02-28 |
Semiconductor chip and method of processing a semiconductor chip
App 20190043818 - BONART; Dietrich ; et al. | 2019-02-07 |
Method of Forming an Aluminum Oxide Layer, Metal Surface with Aluminum Oxide Layer, and Electronic Device
App 20180366427 - Rogalli; Michael ; et al. | 2018-12-20 |
Semiconductor Device with Metal Structure Electrically Connected to a Conductive Structure
App 20180350761 - Schneegans; Manfred ; et al. | 2018-12-06 |
Semiconductor chip and method of processing a semiconductor chip
Grant 10,134,697 - Bonart , et al. November 20, 2 | 2018-11-20 |
Semiconductor Devices for Integration with Light Emitting Chips and Modules Thereof
App 20180308830 - Bonart; Dietrich ; et al. | 2018-10-25 |
Semiconductor device with metal structure electrically connected to a conductive structure
Grant 10,090,265 - Schneegans , et al. October 2, 2 | 2018-10-02 |
Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
Grant 10,049,994 - Gatterbauer , et al. August 14, 2 | 2018-08-14 |
Semiconductor devices for integration with light emitting chips and modules thereof
Grant 9,966,368 - Bonart , et al. May 8, 2 | 2018-05-08 |
Multi-layer metal pads
Grant 9,887,170 - Schneegans , et al. February 6, 2 | 2018-02-06 |
Semiconductor chip device
Grant 9,875,978 - Gatterbauer , et al. January 23, 2 | 2018-01-23 |
Multi-Layer Metal Pads
App 20170317042 - Schneegans; Manfred ; et al. | 2017-11-02 |
Semiconductor Devices for Integration with Light Emitting Chips and Modules Thereof
App 20170271313 - Bonart; Dietrich ; et al. | 2017-09-21 |
Semiconductor devices for integration with light emitting chips and modules thereof
Grant 9,704,839 - Bonart , et al. July 11, 2 | 2017-07-11 |
Multi-layer metal pads
Grant 9,666,546 - Schneegans , et al. May 30, 2 | 2017-05-30 |
Semiconductor Devices For Integration With Light Emitting Chips And Modules Thereof
App 20170141090 - Bonart; Dietrich ; et al. | 2017-05-18 |
Semiconductor Chip Device
App 20170110423 - Gatterbauer; Johann ; et al. | 2017-04-20 |
Method for processing a semiconductor workpiece and semiconductor workpiece
Grant 9,627,335 - Henneck , et al. April 18, 2 | 2017-04-18 |
Semiconductor Device with Metal Structure Electrically Connected to a Conductive Structure
App 20160379947 - Schneegans; Manfred ; et al. | 2016-12-29 |
Methods for making a semiconductor chip device
Grant 9,502,248 - Gatterbauer , et al. November 22, 2 | 2016-11-22 |
Semiconductor chip and method of processing a semiconductor chip
App 20160204075 - BONART; Dietrich ; et al. | 2016-07-14 |
Electrolyte, Method Of Forming A Copper Layer And Method Of Forming A Chip
App 20160168739 - ROBL; Werner ; et al. | 2016-06-16 |
Conductive pads and methods of formation thereof
Grant 9,362,216 - Gatterbauer , et al. June 7, 2 | 2016-06-07 |
Method for processing a semiconductor workpiece with metallization
Grant 9,293,371 - Reitmeier , et al. March 22, 2 | 2016-03-22 |
Semiconductor device comprising a protective structure on a chip backside and method of producing the same
Grant 9,209,080 - Schneegans , et al. December 8, 2 | 2015-12-08 |
Method for Processing a Semiconductor Workpiece and Semiconductor Workpiece
App 20150325535 - HENNECK; Stephan ; et al. | 2015-11-12 |
Method For Processing A Semiconductor Workpiece
App 20150294911 - Reitmeier; Anja ; et al. | 2015-10-15 |
Conductive Pads and Methods of Formation Thereof
App 20150287668 - Gatterbauer; Johann ; et al. | 2015-10-08 |
Metal Deposition with Reduced Stress
App 20150235855 - Schneegans; Manfred ; et al. | 2015-08-20 |
Method for processing a semiconductor workpiece with metallization
Grant 9,093,385 - Gissibl , et al. July 28, 2 | 2015-07-28 |
Conductive pads and methods of formation thereof
Grant 9,082,626 - Gatterbauer , et al. July 14, 2 | 2015-07-14 |
Conductive Pads and Methods of Formation Thereof
App 20150028461 - Gatterbauer; Johann ; et al. | 2015-01-29 |
Method For Processing A Semiconductor Workpiece
App 20140357055 - Gissibl; Anja ; et al. | 2014-12-04 |
Contact Pads with Sidewall Spacers and Method of Making Contact Pads with Sidewall Spacers
App 20140319689 - Gatterbauer; Johann ; et al. | 2014-10-30 |
Contact pads with sidewall spacers and method of making contact pads with sidewall spacers
Grant 8,822,327 - Gatterbauer , et al. September 2, 2 | 2014-09-02 |
Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement
Grant 8,765,531 - Gatterbauer , et al. July 1, 2 | 2014-07-01 |
Semiconductor Device and Method of Producing the Same
App 20140167224 - Schneegans; Manfred ; et al. | 2014-06-19 |
Metal Deposition with Reduced Stress
App 20140117509 - Schneegans; Manfred ; et al. | 2014-05-01 |
Method For Manufacturing A Metal Pad Structure Of A Die, A Method For Manufacturing A Bond Pad Of A Chip, A Die Arrangement And A Chip Arrangement
App 20140054800 - Gatterbauer; Johann ; et al. | 2014-02-27 |
Contact Pads with Sidewall Spacers and Method of Making Contact Pads with Sidewall Spacers
App 20140048941 - Gatterbauer; Johann ; et al. | 2014-02-20 |
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