Wei; Zhengying
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wei; Zhengying.The latest application filed is for "method for improving hdp filling defects through sti etching process".
- Wei; Zhengying - Shanghai CN
- WEI; Zhengying - Xi'an CN
| Patent | Date |
|---|---|
| Method for improving HDP filling defects through STI etching process Grant 11,342,217 - Wei , et al. May 24, 2 | 2022-05-24 |
| Method for Improving HDP Filling Defects through STI Etching Process App 20220148909 - Wei; Zhengying ; et al. | 2022-05-12 |
| Dynamic Slicing Method For Additive Manufacturing Forming With Variable Forming Direction App 20220100170 - WEI; Zhengying ; et al. | 2022-03-31 |
| Method for Forming Doped Epitaxial Layer of Contact Image Sensor App 20220069145 - Qiu; Chenchen ; et al. | 2022-03-03 |
| Method and structure for self aligned contact for integrated circuits Grant 8,507,378 - Liu , et al. August 13, 2 | 2013-08-13 |
| Method And Structure For Self Aligned Contact For Integrated Circuits App 20110037130 - Liu; ChiKang ; et al. | 2011-02-17 |
| Method for Forming a Shallow Trench Isolation Structure App 20080081433 - Koh; Leong Tce ; et al. | 2008-04-03 |
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