Wei; Yung-Tsung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wei; Yung-Tsung.The latest application filed is for "cmp process of high selectivity".

Company Profile

0.3.14

Wei; Yung-Tsung - Tainan Hsien TW
Wei, Yung-Tsung - Pai-Ho Chen TW
Wei, Yung-Tsung - Tainan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation Grant 7,232,752 - Hu , et al. June 19, 2	2007-06-19
Cmp Process Of High Selectivity App 20060252266 - Lee; Chih-Yueh ; et al.	2006-11-09
Post-CMP removal of surface contaminants from silicon wafer Grant 6,696,361 - Hu , et al. February 24, 2	2004-02-24
Post-CMP removal of surface contaminants from silicon wafer App 20040033696 - Hu, Shao-Chung ; et al.	2004-02-19
Chemical mechanical polishing method for copper Grant 6,616,510 - Hsu , et al. September 9, 2	2003-09-09
Carrier Head For Chemical Mechanical Polishing App 20030079836 - Lin, Juen-Kuen ; et al.	2003-05-01
Method for removing hard-mask layer after metal-CMP in dual-damascene interconnect structure App 20020182853 - Chen, Hsueh-Chung ; et al.	2002-12-05
Method for surface treatment protecting metallic surface of semiconductor structure App 20020177308 - Chen, Hsueh-Chung ; et al.	2002-11-28
Post-CMP removal of surface contaminants from silicon App 20020155681 - Hu, Shao-Chung ; et al.	2002-10-24
Method of fabricating a damascene structure App 20020137319 - Hsu, Chia-Lin ; et al.	2002-09-26
Method For Stabilizing Low Dielectric Constant Materials App 20020115305 - Tsai, Cheng-Yuan ; et al.	2002-08-22
Method of fabricating a damascene structure App 20020106877 - Hsu, Chia-Lin ; et al.	2002-08-08
Method for manufacturing cooper interconnects by using a cap layer App 20020102840 - Tsai, Teng-Chun ; et al.	2002-08-01
Method for improving curvature of the polished surface by chemical mechanical polishing App 20020090893 - Hsu, Chia-Lin ; et al.	2002-07-11
Method for removing carbon-rich particles adhered on the exposed copper surface of a copper/low k dielectric dual damascene structure App 20020068435 - Tsai, Teng-Chun ; et al.	2002-06-06
Method for removing carbon-rich particles adhered on a copper surface App 20020068455 - Tsai, Teng-Chun ; et al.	2002-06-06
Chemical mechanical polishing method for copper App 20020065025 - Hsu, Chia-Lin ; et al.	2002-05-30

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