WEI; YONG-CHAO

Patent Applications and Registrations

Patent applications and USPTO patent grants for WEI; YONG-CHAO.The latest application filed is for "circuit board with at least one embedded electronic component and method for manufacturing the same".

Company Profile

1.10.11

WEI; YONG-CHAO - Qinhuangdao CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged Circuit Structure Including Circuit Strcutre With Antenna App 20220230973 - WEI; YONG-CHAO ; et al.	2022-07-21
Circuit Board With At Least One Embedded Electronic Component And Method For Manufacturing The Same App 20220232697 - WEI; YONG-CHAO	2022-07-21
Circuit board with an embedded an electronic component and method for manufacturing the same Grant 11,363,726 - Gao , et al. June 14, 2	2022-06-14
Circuit Board With At Least One Embedded Electronic Component And Method For Manufacturing The Same App 20220167500 - WEI; YONG-CHAO	2022-05-26
Packaged circuit structure including circuit structure with antenna and method for manufacturing the same Grant 11,322,463 - Wei , et al. May 3, 2	2022-05-03
Circuit board with at least one embedded electronic component and method for manufacturing the same Grant 11,324,115 - Wei May 3, 2	2022-05-03
Packaged Circuit Structure Including Circuit Strcutre With Antenna And Method For Manufacturing The Same App 20220084963 - WEI; YONG-CHAO ; et al.	2022-03-17
Circuit Board And Manufacturing Method Thereof App 20220078922 - HO; MING-JAAN ; et al.	2022-03-10
Packaged circuit structure and method for manufacturing the same Grant 11,257,773 - Wei , et al. February 22, 2	2022-02-22
Circuit Board With An Embedded An Electronic Component And Method For Manufacturing The Same App 20220039266 - GAO; LIN-JIE ; et al.	2022-02-03
Packaged Circuit Structure And Method For Manufacturing The Same App 20220037270 - WEI; YONG-CHAO ; et al.	2022-02-03
Method For Manufacturing Component Embedded Circuit Board App 20220030720 - WEI; YONG-CHAO ; et al.	2022-01-27
Circuit board and manufacturing method thereof Grant 11,212,922 - Ho , et al. December 28, 2	2021-12-28
Component embedded circuit board with antenna structure and method for manufacturing the same Grant 11,178,777 - Wei , et al. November 16, 2	2021-11-16
Circuit Board And Manufacturing Method Thereof App 20210235590 - HO; MING-JAAN ; et al.	2021-07-29
Circuit Board App 20200413529 - WEI; YONG-CHAO ; et al.	2020-12-31
Component Embedded Circuit Board With Antenna Structure And Method For Manufacturing The Same App 20200413547 - WEI; YONG-CHAO ; et al.	2020-12-31
Circuit board and method for manufacturing the same Grant 10,764,992 - Wei , et al. Sep	2020-09-01
High-frequency circuit board and method for manufacturing the same Grant 10,645,800 - Yang , et al.	2020-05-05
Circuit board and manufacturing method Grant 10,462,902 - Huang , et al. Oc	2019-10-29
Circuit board and method for manufacturing the same Grant 10,349,518 - Huang , et al. July 9, 2	2019-07-09

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