Patent | Date |
---|
Package structure and method of fabricating the same Grant 11,456,287 - Hu , et al. September 27, 2 | 2022-09-27 |
Forming large chips through stitching Grant 11,444,038 - Wei , et al. September 13, 2 | 2022-09-13 |
Package structures and methods of forming the same Grant 11,417,580 - Yu , et al. August 16, 2 | 2022-08-16 |
Stacked Integrated Circuit Structure and Method of Forming App 20220246581 - Chen; Wei-Ming ;   et al. | 2022-08-04 |
Semiconductor Device And Manufacturing Method Thereof App 20220102288 - Hung; Wensen ;   et al. | 2022-03-31 |
Package Structure App 20210375769 - CHENG; Chih-Kai ;   et al. | 2021-12-02 |
Giga Interposer Integration through Chip-On-Wafer-On-Substrate App 20210366814 - Hou; Shang-Yun ;   et al. | 2021-11-25 |
Semiconductor device and method of manufacture Grant 11,183,399 - Wei , et al. November 23, 2 | 2021-11-23 |
Package Structure and Method and Equipment for Forming the Same App 20210343619 - Hung; Wensen ;   et al. | 2021-11-04 |
Package Structures and Methods of Forming the Same App 20210327778 - Yu; Chen-Hua ;   et al. | 2021-10-21 |
Integrated Circuit Package And Method Of Forming Same App 20210320097 - Hou; Shang-Yun ;   et al. | 2021-10-14 |
Method of forming a dummy die of an integrated circuit having an embedded annular structure Grant 11,101,260 - Hou , et al. August 24, 2 | 2021-08-24 |
Semiconductor device and method of manufacture Grant 11,101,140 - Wei , et al. August 24, 2 | 2021-08-24 |
Package structure having line connected via portions Grant 11,088,079 - Cheng , et al. August 10, 2 | 2021-08-10 |
Stacked Integrated Circuit Structure and Method of Forming App 20210242173 - Chen; Wei-Ming ;   et al. | 2021-08-05 |
Chip package having die structures of different heights and method of forming same Grant 11,069,657 - Wei , et al. July 20, 2 | 2021-07-20 |
Package structure and method and equipment for forming the same Grant 11,062,971 - Hung , et al. July 13, 2 | 2021-07-13 |
Stacked integrated circuit structure and method of forming Grant 10,985,137 - Chen , et al. April 20, 2 | 2021-04-20 |
Stacked integrated circuit structure and method of forming Grant 10,964,667 - Chen , et al. March 30, 2 | 2021-03-30 |
Package Structure And Method Of Fabricating The Same App 20210066151 - Hu; Hsien-Pin ;   et al. | 2021-03-04 |
Package Structure And Method For Forming The Same App 20200411440 - CHENG; Chih-Kai ;   et al. | 2020-12-31 |
Package Structures and Methods of Forming the Same App 20200402877 - Yu; Chen-Hua ;   et al. | 2020-12-24 |
3D packages and methods for forming the same Grant 10,854,567 - Hou , et al. December 1, 2 | 2020-12-01 |
Package structures and methods of forming the same Grant 10,770,365 - Yu , et al. Sep | 2020-09-08 |
Package Structure and Method and Equipment for Forming the Same App 20200219786 - Hung; Wensen ;   et al. | 2020-07-09 |
Chip Package Having Die Structures of Different Heights and Method of Forming Same App 20200152602 - Wei; Wen-Hsin ;   et al. | 2020-05-14 |
3D Packages and Methods for Forming the Same App 20200126938 - Hou; Shang-Yun ;   et al. | 2020-04-23 |
Forming Large Chips Through Stitching App 20200111755 - Wei; Wen Hsin ;   et al. | 2020-04-09 |
Stacked Integrated Circuit Structure and Method of Forming App 20200035647 - Chen; Wei-Ming ;   et al. | 2020-01-30 |
Semiconductor Device and Method of Manufacture App 20200027750 - Wei; Wen-Hsin ;   et al. | 2020-01-23 |
Chip package having die structures of different heights and method of forming same Grant 10,535,633 - Wei , et al. Ja | 2020-01-14 |
3D packages and methods for forming the same Grant 10,529,679 - Hou , et al. J | 2020-01-07 |
Forming large chips through stitching Grant 10,515,906 - Wei , et al. Dec | 2019-12-24 |
Integrated Circuit Package And Method Of Forming Same App 20190237454 - Hou; Shang-Yun ;   et al. | 2019-08-01 |
Chip package having die structures of different heights Grant 10,319,699 - Wei , et al. | 2019-06-11 |
Semiconductor Device and Method of Manufacture App 20190148166 - Wei; Wen-Hsin ;   et al. | 2019-05-16 |
Stacked Integrated Circuit Structure and Method of Forming App 20190115320 - Chen; Wei-Ming ;   et al. | 2019-04-18 |
Package Structures and Methods of Forming the Same App 20190115272 - Yu; Chen-Hua ;   et al. | 2019-04-18 |
Formation method of chip package Grant 10,163,853 - Wei , et al. Dec | 2018-12-25 |
Stacked integrated circuit structure and method of forming Grant 10,163,856 - Chen , et al. Dec | 2018-12-25 |
Package structures and methods of forming the same Grant 10,153,222 - Yu , et al. Dec | 2018-12-11 |
Chip Package Having Die Structures of Different Heights and Method of Forming Same App 20180254260 - Wei; Wen-Hsin ;   et al. | 2018-09-06 |
Package Structures And Methods Of Forming The Same App 20180138101 - Yu; Chen-Hua ;   et al. | 2018-05-17 |
Formation Method Of Chip Package App 20180047703 - WEI; Wen-Hsin ;   et al. | 2018-02-15 |
Chip Package Having Die Structures of Different Heights and Method of Forming Same App 20180040586 - Wei; Wen-Hsin ;   et al. | 2018-02-08 |
Forming Large Chips Through Stitching App 20170373022 - Wei; Wen Hsin ;   et al. | 2017-12-28 |
Structure and formation method for chip package Grant 9,818,720 - Wei , et al. November 14, 2 | 2017-11-14 |
Chip package having die structures of different heights and method of forming same Grant 9,806,058 - Wei , et al. October 31, 2 | 2017-10-31 |
Forming large chips through stitching Grant 9,741,669 - Wei , et al. August 22, 2 | 2017-08-22 |
Forming Large Chips Through Stitching App 20170213798 - Wei; Wen Hsin ;   et al. | 2017-07-27 |
Stacked Integrated Circuit Structure and Method of Forming App 20170125379 - Chen; Wei-Ming ;   et al. | 2017-05-04 |
Structure And Formation Method For Chip Package App 20170005071 - WEI; Wen-Hsin ;   et al. | 2017-01-05 |
Structure And Formation Method For Chip Package App 20170005072 - WEI; Wen-Hsin ;   et al. | 2017-01-05 |
Central Controller And Resource Allocation Method Thereof For Use In A Cellular Network App 20160050671 - YU; Ya-Ju ;   et al. | 2016-02-18 |
3D Packages and Methods for Forming the Same App 20150262958 - Hou; Shang-Yun ;   et al. | 2015-09-17 |
3D packages and methods for forming the same Grant 9,048,231 - Hou , et al. June 2, 2 | 2015-06-02 |
Base Station And User Equipment Authentication Method Thereof App 20150140967 - LEU; Chun-Teh ;   et al. | 2015-05-21 |
3D Packages and Methods for Forming the Same App 20140306341 - Hou; Shang-Yun ;   et al. | 2014-10-16 |
3D packages and methods for forming the same Grant 8,802,504 - Hou , et al. August 12, 2 | 2014-08-12 |
Femtocell And Resource Control Method Thereof App 20130107866 - Leu; Chun-Teh ;   et al. | 2013-05-02 |
System and method of measuring heterogeneous network mobile communication apparatus and recording medium thereof Grant 8,059,604 - Su , et al. November 15, 2 | 2011-11-15 |
Method of mobile terminal for handover/switch among different wireless communication networks in a heterogeneous network environment App 20080167046 - Liao; Tung-Yi ;   et al. | 2008-07-10 |
System and method of measuring heterogeneous network mobile communication apparatus and recording medium thereof App 20080144580 - Su; Chih-Wei ;   et al. | 2008-06-19 |