Wei; Shih-Long

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wei; Shih-Long.The latest application filed is for "packaging device of electronic components and an encapsulation method thereof".

Company Profile

1.13.24

Wei; Shih-Long - Taipei TW
WEI; Shih-Long - Taipei City TW
Wei; Shih-Long - New Taipei N/A TW
Wei; Shih-Long - New Taipei City TW
Wei; Shih-Long - Hsinchu County TW
Wei; Shih-Long - Hsinchu County 303 TW
Wei; Shih-Long - Hukou Township TW
Wei; Shih-Long - Yonghe City TW
Wei; Shih-Long - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaging device of electronic components and an encapsulation method thereof Grant 10,864,666 - Wang , et al. December 15, 2	2020-12-15
Packaging Device Of Electronic Components And An Encapsulation Method Thereof App 20190134865 - WANG; Kao-Yuan ; et al.	2019-05-09
Method for manufacturing anticorrosive thin film resistor and structure thereof Grant 9,508,474 - Wei November 29, 2	2016-11-29
Method For Manufacturing Anticorrosive Thin Film Resistor And Structure Thereof App 20160211058 - Wei; Shih-Long	2016-07-21
Resistor component Grant 9,373,430 - Wei , et al. June 21, 2	2016-06-21
Method of electroplating and depositing metal Grant 9,204,555 - Wei , et al. December 1, 2	2015-12-01
Method for forming package substrate Grant 8,841,172 - Wei , et al. September 23, 2	2014-09-23
Method of Forming Substrate App 20140170848 - Wei; Shih-Long ; et al.	2014-06-19
Resistor Component App 20140167911 - Wei; Shih-Long ; et al.	2014-06-19
Method of Fabricating a Light Emitting Diode Packaging Structure App 20140027051 - Wei; Shih-Long ; et al.	2014-01-30
Method of Electroplating and Depositing Metal App 20140001051 - Wei; Shih-Long ; et al.	2014-01-02
Method For Fabricating Conductive Structures of Substrate App 20130313122 - Wei; Shih-Long ; et al.	2013-11-28
Method of manufacturing a metallized ceramic substrate Grant 8,591,756 - Wei , et al. November 26, 2	2013-11-26
Method for manufacturing alloy resistor Grant 8,590,140 - Wei , et al. November 26, 2	2013-11-26
Method for Selective Metallization on a Ceramic Substrate App 20130098867 - Wei; Shih-Long ; et al.	2013-04-25
Method of Fabricating a Substrate Having Conductive Through Holes App 20130089982 - WEI; Shih-Long ; et al.	2013-04-11
Light Emitting Diode Packaging Structure and Method of Fabricating the Same App 20130082292 - Wei; Shih-Long ; et al.	2013-04-04
Method of Manufacturing a Metallized Ceramic Substrate App 20130048602 - Wei; Shih-Long ; et al.	2013-02-28
Method for Forming Package Substrate App 20120317806 - Wei; Shih-Long ; et al.	2012-12-20
Package Substrate and Method for Forming the Same App 20120211792 - Wei; Shih-Long ; et al.	2012-08-23
Method For Forming Conductive Via In A Substrate App 20120064230 - Wei; Shih-Long ; et al.	2012-03-15
Method for Manufacturing Alloy Resistor App 20120000066 - Wei; Shih-Long ; et al.	2012-01-05
Light-Emitting Diode Packaging Structure and Substrate Therefor App 20120001212 - Wei; Shih-Long ; et al.	2012-01-05
Method of making a current sensing chip resistor Grant 7,640,652 - Hsiao , et al. January 5, 2	2010-01-05
Method of making a current sensing chip resistor App 20080194057 - Hsiao; Shen-Li ; et al.	2008-08-14
Method for forming a metallurgical interconnection layer package for a multilayer ceramic substrate Grant 5,292,624 - Wei March 8, 1	1994-03-08

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