Wei; Paul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wei; Paul.The latest application filed is for "coated abrasive products and processes for forming same".

Company Profile

0.6.4

Wei; Paul - Tonawanda NY
Wei; Paul - San Diego CA
WEI, PAUL - LATHAM NY
Wei; Paul - Amherst NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Processes for forming coated abrasive products Grant 8,349,406 - Wei , et al. January 8, 2	2013-01-08
Coated abrasive products and processes for forming same App 20060288649 - Wei; Paul ; et al.	2006-12-28
Synchronization of mobile station location measurement with CDMA service Grant 7,035,648 - Czaja , et al. April 25, 2	2006-04-25
Coated abrasive products and processes for forming same App 20050210756 - Wei, Paul ; et al.	2005-09-29
Synchronization of mobile station location measurement with CDMA service App 20030100314 - Czaja, Stanislaw ; et al.	2003-05-29
Determining the received data rate in a variable rate communications system Grant 6,370,672 - Rick , et al. April 9, 2	2002-04-09
Production Of Layered Engineered Abrasive Surfaces App 20010003884 - WEI, PAUL ; et al.	2001-06-21
Coated abrasive Grant 6,048,375 - Yang , et al. April 11, 2	2000-04-11
Rotogravure process for production of patterned abrasive surfaces Grant 5,840,088 - Yang , et al. November 24, 1	1998-11-24
Structured abrasives with adhered functional powders Grant 5,833,724 - Wei , et al. November 10, 1	1998-11-10

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